Abstract: A method for testing a system module assembled by integrated circuits during mass production. The integrated circuits and the assembled system modules are manufactured by the same manufacturer. The method includes the steps of apply a plurality of system level tests to the system module to determine the performance of the system module. Next, verify the performance of the integrated circuits based on the results of the system level tests. Finally, perform integrated circuit level tests, wherein the integrated circuit level tests include test items unverifiable by the system level tests. The present invention also includes a testing apparatus for testing a system module.

Abstract: The present invention is a method of forming plugs for engaging with a socket on a substrate having pads thereon. The method including the steps of forming an insulation layer on the substrate, patterning the insulation layer to form openings for exposing the pads by a wet etching, respectively, forming conductive plugs in the openings to electrically connect with the pads, and partially removing the insulation layer.