Abstract: The present invention relates to a cooling system of a furnace, and more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened.

Abstract: The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened.

Abstract: The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The multi-cycle cooling system comprises the first gas cooling cycle, the second gas cooling cycle, the first liquid cooling cycle, the second liquid cooling cycle, the heat sinks and the heat insulation slot. When inside the process tube proceeds the high temperature process like depositing process, the first gas cooling cycle and the second gas cooling cycle are opened and the second liquid cooling cycle is closed at the same time. The second gas cooling cycle and the second liquid cooling cycle are assembled in the first flange, which is located on the process tube and contacts with the door. The first liquid cooling cycle in the second flange, which is located on the process tube and contacts with the first range, is always opened.

Abstract: The present invention relates to a cooling system of a furnace, more particularly, to a multi-cycle cooling system, located by the furnace door. The probability of pollution by particles can be decreased and the lifetime of the furnace devices can be extended by using different liquid and gas cycles, cooling the different steps the semiconductor processes in the furnace.

Abstract: A method and apparatus for reducing particle contamination on wafers is disclosed. The method includes providing a semiconductor furnace system having an ideal reaction chamber, an electrostatic generator, a conducting wire, and a conductive ring. Moreover, an insulating layer is coated over the entire wafer boat carrier, that is part of the reaction chamber. Charges with a first polarity are generated after a reaction process carried out inside the chamber and before the “vacuum breaking” stage. These charges spread evenly across the entire exposed surface of the wafer boat carrier and repulse particles carrying the same polarity away from the wafers that are in process.

Abstract: A fluid flow control apparatus precisely controls a slight flow of fluid being mixed with a carrier gas. The apparatus includes a container for containing the fluid and a conduit for conducting the fluid, one portion of the conduit having a smaller diameter than the other, the smaller diameter portion of the conduit Including a needle valve for controlling the flow of the carrier gas into the conduit. A fluid transmission line connected at one end to the conduit and at the other end to the container conducts fluid from the container into the conduit to be mixed with the carrier gas before the mixture is introduced into a reacting chamber.

Abstract: Improved gas exhaust apparatus of a semiconductor plant for substantially reducing the accumulation of solid substance on the surface of a gas exhaust system is disclosed. The apparatus includes a heating section for providing a thermal chamber, thereby transforming incoming gas and oxygen into solid substance. A barrier section is secured to an inner surface of the heating section for preventing the solid substance from accumulating on the inner surface of the heating section. A scrubbing section attached to the heating section is used to expel the solid substance out of the gas exhaust apparatus.