Abstract: The feed point adjustable planar antenna includes a ground component, a main radiation plane, a branch line extended from the main radiation plane, and a ground pin electrically connecting the radiation component with the ground component. If it needs to fine tune the frequency band interval after the design of the antenna is completed, the feed position of the coaxial cable to the branch line can be changed to achieve the fine tuning without cutting the antenna. The ground pin extends from a side edge of the ground component and the branch line is adjacent to the ground component. The branch line and the ground component form a larger coupling range than the conventional planar antenna does. In the mean time, the coaxial cable also has a larger feed range than the conventional planar antenna does.

Abstract: The feed point adjustable planar antenna includes a ground component, a main radiation plane, a branch line extended from the main radiation plane, and a ground pin electrically connecting the radiation component with the ground component. If it needs to fine tune the frequency band interval after the design of the antenna is completed, the feed position of the coaxial cable to the branch line can be changed to achieve the fine tuning without cutting the antenna. The ground pin extends from a side edge of the ground component and the branch line is adjacent to the ground component. The branch line and the ground component form a larger coupling range than the conventional planar antenna does. In the mean time, the coaxial cable also has a larger feed range than the conventional planar antenna does.

Abstract: A mixed-voltage I/O buffer comprises an input circuit, an output circuit, an I/O pad, a pre-driver circuit coupled to the output circuit, two added coupled N-type transistors, and a dynamical gate-controlled circuit coupled to each gate of the two N-type transistors and the pre-driver circuit; one of the N-type transistors is coupled to the input circuit and the output circuit; the other N-type transistor and the dynamic gate-controlled circuit are together coupled to the I/O pad. Thereby, a mixed-voltage I/O buffer which receives 2×VDD-tolerant input signals and overcomes the hot-carrier degradation is realized.

Abstract: A method for manufacturing microchip antenna comprises a dielectric substrate having antenna radiation conductor paths composing of at least one feeding point and multiple-curved paths; a dielectric substrate having the antenna radiation conductor paths being packaged by the material capable of adjusting easily dielectric constant; and an antennal object including antenna radiation conductor paths, feeding ends, welding spots and packaging materials. The main body of the antenna has multi-folded paths, feeding ends, welding spots, and a packaging body. The radiation wires of the antenna is built on a single or a multiple input ends on a dielectric substrate and is multi-folded wires and it is packaged by another dielectric material. The radiation wires of the antenna can be designed and manufactured in three dimension so as to reduce the area occupied by the antenna and reduce the coupling interference between the elements.

Abstract: A circuit configured for providing hot-carrier effect protection, the circuit comprising a first transistor including a first terminal and a second terminal, the first terminal being coupled to a conductive pad, a switch device including a terminal coupled to the conductive pad, and a control circuit configured for keeping the switch at an off state during a receiving mode at which a signal of a first voltage level or a reference level is received at the conductive pad, keeping the switch at the off state during a transmitting mode from which a signal of a second voltage level or the reference level is transmitted at the conductive pad, and keeping the switch at an on state during a transition from the receiving mode when receiving a signal of the first voltage level to the transmitting mode when transmitting a signal having the reference voltage level, wherein during the transition a voltage across the first terminal and the second terminal of the first transistor is maintained at a level below approximately

Abstract: An integrating SOC capable of integrating a micro-antenna System on Chip (SOC) of integrating micro-antennas comprises an existing radio frequency model, a circuit board and an antenna element to a package of single SOC. The micro-antenna element is formed by using antenna radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths. Active or passive elements are selected to match up the antenna element and relative circuits, and arranges on the circuit board. Then by using embedding type injection molding or glue-filling modeling, the single SOC is finished by the package of a radio frequency model and an antenna element.

Abstract: The present invention relates to an ELISA kit for diagnosing infectious bursal disease (IBD). In particular, the present invention provides an indirect ELISA kit comprising recombinant VP2H or VP3 as the antigen for detecting anti-IBDV antibodies in serum samples. The present invention relates to a method for diagnosing infectious bursal disease (IBD) by using the ELISA kit. The present invention also provides a method for preparing the recombinant VP3 protein with high recovery yield in E. coli expression system.

Abstract: An integrating SOC capable of integrating a micro-antenna System on Chip (SOC) of integrating micro-antennas comprises an existing radio frequency model, a circuit board and an antenna element to a package of single SOC. The micro-antenna element is formed by using antenna radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths. Active or passive elements are selected to match up the antenna element and relative circuits, and arranges on the circuit board. Then by using embedding type injection molding or glue-filling modeling, the single SOC is finished by the package of a radio frequency model and an antenna element.

Abstract: A method for manufacturing microchip antenna comprises a dielectric substrate having antennal radiated conductor paths composing of a single-feeding end or multiple-feeding ends and multiple-curved paths; a dielectric substrate having the antennal radiated conductor paths being packaged by the material capable of adjusting easily dielectric constant; and an antennal object including antennal radiated conductor paths, feeding ends, welding spots and packaging materials. The main body of the antenna has multi-folded paths, feeding ends, welding spots, and a packaging body. The radiation wires of the antenna is built on a single or a multiple input ends on a dielectric substrate and is multi-folded wires and it is packaged by another dielectric material. The radiation wires of the antenna can be designed and manufactured in three dimension so as to reduce the area occupied by the antenna and reduce the coupling interference between the elements.