Abstract: A method for manufacturing an electronic device is provided. The method for manufacturing the electronic device includes: providing a substrate with elements disposed thereon and transferring a portion of the elements from the substrate to a driving substrate, wherein transferring the portion of the elements from the substrate to the driving substrate includes: transferring the portion of the elements from the substrate to the driving substrate, which comprises illuminating regions of the substrate overlapped with the portion of the elements by an energy beam, wherein when the substrate is illuminated by the energy beam, the substrate and the driving substrate are separated by a gap.

Abstract: The present invention relates to CD3-binding molecules capable of binding to human and non-human CD3, and in particular to such molecules that are cross-reactive with CD3 of a non-human mammal (e.g., a cynomolgus monkey). The invention also pertains to uses of such antibodies and antigen-binding fragments in the treatment of cancer, autoimmune and/or inflammatory diseases and other conditions.

Abstract: A light-emitting module of an illuminated keyboard includes a reflector plate, a light guiding plate, a light shielding plate, a base plate, a thin film circuit board, and a light-emitting element. The light guiding plate is disposed on the reflector plate. The light shielding plate is disposed on the light guiding plate and includes a through hole and a first light-passing hole that is spaced apart from the through hole. The base plate is disposed on the light shielding plate and includes an accommodating hole that is aligned with the through hole and a second light-passing hole that is spaced part from the accommodating hole and that is aligned with the first light-passing hole. The thin film circuit board is disposed on the base plate. The light-emitting element is disposed on the thin film circuit board and extends into the accommodating hole.

Abstract: Disclosed herein are methods of preventing or treating ALS by use of a modified EKLF polypeptide, a modified nucleic acid encoding the modified EKLF polypeptide, or modified bone marrow cells comprising the modified nucleic acid. According to embodiments of the present disclosure, the modified EKLF polypeptide comprises an amino acid modification that confers reduced sumoylation in a wild-type EKLF polypeptide.

Abstract: Cell culture mediums for generating organoids, including tumour organoids. Specifically, such mediums comprise: a cell culture medium; an antioxidant; a serum free supplement; an insulin receptor agonist; a glucocorticoid; and an FGFR agonist. Other aspects involve methods of generating tumour organoids from tumours. Such methods can comprise generating pancreatic progenitor organoids from pluripotent stem cells, pancreatic lineage committed progenitors.

Abstract: A height-adjustable desk includes a base, a desk board assembly, a support arm assembly and a supporter. The desk board assembly is above the base, and the support arm assembly is a rhombic linkage mechanism. The support arm assembly includes a first arm segment, a second arm segment, a third arm segment and a fourth arm segment. Bottom ends of the first and second arm segments rotatably connect with the base, and top ends of the third and fourth arm segments rotatably connect with the desk board assembly. A top end of the first arm segment rotatably connects with a bottom end of the third arm segment, and a top end of the second arm segment rotatably connects with a bottom end of the fourth arm segment. The first and second arm segments, and the third and fourth arm segments connect in an engaging transmission manner, respectively.

Abstract: The present disclosure provides a semiconductor die structure including a substrate, a first supporting backbone, a first conductor block, and an air gap structure. The first supporting backbone is disposed on the substrate. The first conductor block is disposed on the first supporting backbone, and includes a first barrier layer and a first conductive layer disposed in the first barrier layer. The air gap structure is disposed on the substrate and in contact with the first supporting backbone and the first conductor block.

Abstract: The present disclosure provides a semiconductor die structure including a substrate, a first supporting backbone, a first conductor block, and an air gap structure. The first supporting backbone is disposed on the substrate. The first conductor block is disposed on the first supporting backbone, and includes a first barrier layer and a first conductive layer disposed in the first barrier layer. The air gap structure is disposed on the substrate and in contact with the first supporting backbone and the first conductor block.

Abstract: A controller includes a body and a surrounding part. The body has a control area for sending a control signal according to a movement of a thumb of a user. The surrounding part is connected to the body and used to surround and be fixed to a proximal phalange of an index finger of the user. The body is away from a joint between the proximal phalange and a metacarpal bone of the user.

Abstract: An electronic device includes a first substrate, a second substrate, a circuit layer, a diode element, and a conductive wire. The first substrate has a first surface, a second surface opposite to the first surface, and a first side surface connected between the first surface and the second surface. The second substrate has a third surface, a fourth surface opposite to the third surface, and a second side surface connected between the third surface and the fourth surface, wherein the fourth surface is disposed away from the first surface. The circuit layer and the diode element are disposed on the first surface. The diode element and the conductive wire are electrically connected to the circuit layer. A first portion of the conductive wire is disposed on the first side surface, and a second portion of the conductive wire is disposed on the second side surface.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: The present invention relates to antibodies and their fragments that are immunoreactive to the mammalian, and more particularly, the human B7-H3 receptor and to uses thereof, particularly in the treatment of cancer and inflammation. The invention thus particularly concerns humanized B7-H3-reactive antibodies and their immunoreactive fragments that are capable of mediating, and more preferably enhancing the activation of the immune system against cancer cells that are associated with a variety of human cancers.

Abstract: Methods for the treatment of stroke, such as stroke of undetermined origin, by administration of xenon (Xe)-loaded liposome compositions are provided. In some aspects, Xe is encapsulated in echogenic liposomes and release of Xe can be enhanced by application of ultrasound stimulation. Compositions for use in treating stroke, such as liposomes loaded with Xe or Xe in combination with H2 or H2S, are also provided.

Abstract: A use of perilla in the manufacture of a medicament for inhibition of Coronavirus disease 2019 (COVID-19) virus is provided. Perilla is treatment by ultrafine pulverization and wall-breaking to obtain perilla micropowder with a particles size of 6000 mesh. The perilla micropowder is used in the manufacture of an inhibitor of COVID-19 virus (SARS-COV-2,Omincron variant) and a medicament for treatment, prevention, or relief of diseases caused by COVID-19 virus (SARS-COV-2,Omincron variant).

Abstract: An electronic device includes a first substrate, a circuit layer, a conductive wire, and an adhesive layer. The first substrate has a first surface, a second surface and a first side surface. The second surface is opposite to the first surface, the first side surface is located between the first surface and the second surface, and the first side surface connects the first surface and the second surface. The circuit layer is disposed on the first surface of the first substrate. The conductive wire is electrically connected to the circuit layer. The adhesive layer is disposed on the first surface and the circuit layer. The adhesive layer has a second side surface, and a first portion of the conductive wire is disposed on the first side surface of the first substrate and the second side surface of the adhesive layer.

Abstract: A manufacturing method of a tiling electronic device includes the following steps. A first electronic panel is provided. The first electronic panel includes multiple first bumps and multiple first conducting lines, and the first bumps and the first conducting lines are disposed on a side surface of the first electronic panel. A second electronic panel is provided. The second electronic panel includes multiple second bumps and multiple second conducting lines, and the second bumps and the second conducting lines are disposed on a side surface of the second electronic panel. The first electronic panel and the second electronic panel are coupled through the first bumps and the second bumps. Multiple conducting elements are formed, so that the first conducting lines are electrically connected with the second conducting lines through the conducting elements after the first electronic panel and the second electronic panel are coupled.

Abstract: A semiconductor device structure includes an isolation structure disposed in a semiconductor substrate. The semiconductor device structure also includes a fuse and a resistor electrode disposed in the semiconductor substrate. The isolation structure is disposed between the fuse and the resistor electrode, and the isolation structure is closer to the resistor electrode than the fuse. The semiconductor device structure further includes a source/drain (S/D) region disposed in the semiconductor substrate and between the fuse and the isolation structure. The S/D region is electrically connected to the resistor electrode.

Abstract: A semiconductor device structure includes an isolation structure disposed in a semiconductor substrate. The semiconductor device structure also includes a fuse and a resistor electrode disposed in the semiconductor substrate. The isolation structure is disposed between the fuse and the resistor electrode, and the isolation structure is closer to the resistor electrode than the fuse. The semiconductor device structure further includes a source/drain (S/D) region disposed in the semiconductor substrate and between the fuse and the isolation structure. The S/D region is electrically connected to the resistor electrode.

Abstract: The present disclosure relates to a system for mounting a display on a wall. The system may include at least one hanger assembly arranged in a vertical direction. The hanger assembly includes a hook assembly configured to engage a wall panel and a movable hanger configured to slidably engage with the hook assembly such that the movable hanger slides in a vertical direction. The system may further include an adjustment assembly having at least one adjustment component and an adjustment actuator. The adjustment component includes an abutment surface configured to slidably engage with a support surface of the hook assembly. The adjustment actuator engages the at least one adjustment component such that the adjustment actuator translates in a direction transverse to the vertical direction to drive the adjustment component to also translate in the transverse direction relative to the movable hanger and the movable hanger to translate in the vertical direction.