Patents by Inventor Ling-Hung WEI

Ling-Hung WEI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230112794
    Abstract: The present invention discloses an monoclonal antibody, which can bind to HyIL-6 with the binding constant 2.86×10?10 and significantly inhibit IL-6/IL-6R/gp130 complex formation. In addition, the monoclonal antibody of the present invention effectively inhibits HyIL-6-stimulated signal transducer and activator of transcription 3(STAT3) activation and related vascular endothelial growth factor (VEGF) induction. Data from hydrogen deuterium exchange mass spectrometry (HDX-MS) demonstrate that the antibody of the present invention mainly binds to site IIIa of IL-6 and blocks the final step in the interaction between gp130 and IL-6/IL-6R complex. Additionally, data from ELISA binding assays and kinetics assays indicate that the antibody of the present invention interacts simultaneously with IL-6 and IL-6R, while it does not interact with IL-6R alone.
    Type: Application
    Filed: October 6, 2022
    Publication date: April 13, 2023
    Inventors: Ling-Hung WEI, Kuo-Tai Hua, Min-Wei Chen, Chun-Chi Chou