Patents by Inventor Ling Lee

Ling Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240142961
    Abstract: A method of estimating greenhouse gas emission, performed by a processing device, includes: obtaining at least one time period of a number of working stations for a target manufacturing process of a product; obtaining a number of first power consumption data of the target manufacturing process, wherein the first power consumption data correspond to the working stations respectively; calculating a number of second power consumption data based on the at least one time period and the first power consumption data; searching for a number of target coefficients corresponding to the plurality of working stations respectively in coefficient database based on the target manufacturing process; and calculating greenhouse gas emission data of the target manufacturing process based on the second power consumption data and the target coefficients.
    Type: Application
    Filed: October 27, 2022
    Publication date: May 2, 2024
    Applicant: INSTITUTE FOR INFORMATION INDUSTRY
    Inventors: Tsung-Hsi LIN, Yun Sheng LI, Yu Ling LEE, Hsiao Pin LIN, Chia Hou CHEN
  • Publication number: 20240134268
    Abstract: A mask for use in a semiconductor lithography process includes a substrate, a mask pattern disposed on the substrate, and a light absorbing border surrounding the mask pattern. The light absorbing border is inset from at least two edges of the substrate to define a peripheral region outside of the light absorbing border. In some designs, a first peripheral region extends from an outer perimeter of the light absorbing border to a first edge of the substrate, and a second peripheral region that extends from the outer perimeter of the light absorbing border to a second edge of the substrate, where the first edge of the substrate and the second edge of the substrate are on opposite sides of the mask pattern.
    Type: Application
    Filed: January 3, 2024
    Publication date: April 25, 2024
    Inventors: Chien-Cheng Chen, Huan-Ling Lee, Ta-Cheng Lien, Chia-Jen Chen, Hsin-Chang Lee
  • Publication number: 20240124844
    Abstract: The present disclosure provides a method for preparing a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors, the composition prepared by the method, and use of the composition for treating arthritis. The composition of the present disclosure achieves the effect of treating arthritis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 18, 2024
    Inventors: Chia-Hsin Lee, Po-Cheng Lin, Yong-Cheng Kao, Ming-Hsi Chuang, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240115616
    Abstract: The present disclosure provides a method for treating liver cirrhosis by using a composition including mesenchymal stem cells, extracellular vesicles produced by the mesenchymal stem cells, and growth factors. The composition of the present disclosure achieves the effect of treating liver cirrhosis through various efficacy experiments.
    Type: Application
    Filed: October 4, 2023
    Publication date: April 11, 2024
    Inventors: Po-Cheng Lin, Pi-Chun Huang, Zih-Han Hong, Ming-Hsi Chuang, Yi-Chun Lin, Chia-Hsin Lee, Chun-Hung Chen, Chao-Liang Chang, Kai-Ling Zhang
  • Publication number: 20240116907
    Abstract: Disclosed are novel fused heterocyclic mescaline derivative compounds, notably fused heterocyclic mescaline derivatives and pharmaceutical and recreational drug formulations containing the same. Methods of making and using these compounds are also disclosed.
    Type: Application
    Filed: August 4, 2023
    Publication date: April 11, 2024
    Inventors: Peter J. Facchini, Jillian M. Hagel, Chang-Chun Ling, Charlie Cai, David James Press, Glynnis Elizabeth Jensen, Jessica Bik-Jing Lee, Kaveh Matinkhoo
  • Publication number: 20240117314
    Abstract: The present invention relates to a method for preparing a modified stem cell, including the following steps: a cell culture step: culturing stem cells in a first culture medium of a culture dish at a predetermined cell density, and removing the first culture medium after a first culture time to obtain a first cell intermediate; an activity stimulation step: preserving the first cell intermediate in a freezing container having a cell cryopreservation solution, and performing a constant temperature stimulation treatment or a variable temperature stimulation treatment for at least more than 1 day; and a product collection step: after completing the activity stimulation step, placing the freezing container in an environment at a thawing temperature for thawing, and then removing the cell cryopreservation solution to obtain the modified stem cell. The modified stem cell can release at least one or more of IL-4, IL-5, IL-13, G-CSF, Fractalkine, and EGF.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Inventors: Ruei-Yue Liang, Chia-Hsin Lee, Kai-Ling Zhang, Po-Cheng Lin, Ming-Hsi Chuang, Yu-Chen Tsai, Peggy Leh Jiunn Wong
  • Publication number: 20240120437
    Abstract: A manufacturing method for a LED is disclosed. The method includes: providing a substrate with an upper surface; preparing a plurality of LEDs on the upper surface; wherein the upper surface is divided into a plurality of zones, the plurality of LEDs composes a plurality of LED groups, and each of the LED group is disposed in one of the plurality of zones; preparing a testing circuit to electrically connecting the plurality of LEDs in one of the plurality of LED groups; testing the plurality of LEDs in the one of the plurality of LED groups by the testing circuit to obtain photoelectrical characteristics of the plurality of LEDs in the one of the plurality of LED groups; and presenting the photoelectric characteristics in an image.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 11, 2024
    Inventors: Chia-Chen TSAI, Jia-Liang TU, Chi-Ling LEE
  • Publication number: 20240118178
    Abstract: A staining kit is provided, including a first pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, CD8, CD45, and CTLA4; a second pattern including antibodies against T cell, B cell, NK cell, monocyte, regulatory cell, dendritic cell, and CD45; a third pattern including antibodies against T cell, B cell, NK cell, monocyte, CD8, CD45, CD45RA, CD62L, CD197, CX3CR1 and TCR??; and a fourth pattern including antibodies against B cell, CD23, CD38, CD40, CD45 and IgM, wherein the antibodies of each pattern are labeled with fluorescent dyes. A method of identifying characterized immune cell subsets of a disease and a method of predicting the likelihood of NPC in a subject in the need thereof using the staining kit are also provided.
    Type: Application
    Filed: October 5, 2022
    Publication date: April 11, 2024
    Applicant: FULLHOPE BIOMEDICAL CO., LTD.
    Inventors: Jan-Mou Lee, Li-Jen Liao, Yen-Ling Chiu, Chih-Hao Fang, Kai-Yuan Chou, Pei-Hsien Liu, Cheng-Yun Lee
  • Publication number: 20240120325
    Abstract: A stacked package structure and a manufacturing method thereof are provided. The stacked package structure includes an upper redistribution layer, a first chip, and an upper molding layer. The first chip is disposed on the upper redistribution layer and is electrically connected to the upper redistribution layer. The upper molding layer is disposed on the first chip and the upper redistribution layer, and is configured to package the first chip. The upper molding layer includes a recess, the recess is recessed relative to a surface of the upper molding layer away from the upper redistribution layer, and the recess is circumferentially formed around a periphery of the upper molding layer.
    Type: Application
    Filed: May 31, 2023
    Publication date: April 11, 2024
    Applicant: POWERTECH TECHNOLOGY INC.
    Inventors: Pei-chun TSAI, Hung-hsin HSU, Shang-yu CHANG CHIEN, Chia-ling LEE
  • Publication number: 20240094626
    Abstract: A pellicle for an extreme ultraviolet (EUV) photomask includes a pellicle frame and a main membrane attached to the pellicle frame. The main membrane includes a plurality of nanotubes, and each of the plurality of nanotubes is covered by a coating layer containing Si and one or more metal elements.
    Type: Application
    Filed: April 12, 2023
    Publication date: March 21, 2024
    Inventors: Pei-Cheng HSU, Wei-Hao LEE, Huan-Ling LEE, Hsin-Chang LEE, Chin-Hsiang LIN
  • Patent number: 11937041
    Abstract: An audio device includes a first earbud and a second earbud, each of which is configured to establish respective first and second wireless links with an audio source, and receive, from the audio source, audio information over the respective first and second wireless links. The first earbud and the second earbud are further configured to communicate with one another over a third wireless link. At least one of the first earbud and the second earbud includes a measurement circuit configured to measure respective signal strengths of the first, second and third wireless links, a computation circuit configured to compute a difference in signal strengths of the first and second wireless links, and a determination circuit configured to determine an operating environment of the audio device based on the computed difference and further based on the signal strength of the third wireless link.
    Type: Grant
    Filed: October 6, 2020
    Date of Patent: March 19, 2024
    Assignee: RAZER (ASIA-PACIFIC) PTE. LTD.
    Inventors: Chee Oei Chan, Kah Yong Lee, Gui Mei Dai, Chung-Ling Lee, Shyh Lai Long
  • Patent number: 11934213
    Abstract: A liquid-cooling device includes multiple water blocks and at least one connection tube. Each of the water blocks has a water incoming end, a water outgoing end and a water-receiving space in communication with the water incoming end and the water outgoing end. The connection tube is disposed between each two water blocks. Two ends of the connection tube are respectively connected with the water incoming end of one of the two water blocks and the water outgoing end of the other water block, whereby the water-receiving spaces of the two water blocks communicate with each other via the connection tube. The connection tube has at least one bellows section between two ends of the connection tube. The liquid-cooling device solves the problems of the conventional liquid-cooling device that when the water block is welded, thermal deformation is produced to cause tolerance and the manufacturing cost is higher.
    Type: Grant
    Filed: February 18, 2021
    Date of Patent: March 19, 2024
    Assignee: ASIA VITAL COMPONENTS (CHINA) CO., LTD.
    Inventors: Pai-Ling Kao, Sung-Wei Lee, Kuan-Lin Huang, Ming-Tsung Yang
  • Publication number: 20240089405
    Abstract: A best available video stream is determined for each of multiple conference participants within a conference room including multiple cameras based on scores determined for video streams obtained from the cameras. The scores are determined based on representations of the conference participants within the video streams, for example, based on percentages of conference participant faces visible within the video streams, directions of conference participant faces relative to the cameras, directions of eye gaze of the conference participants relative to the cameras, and/or degrees to which conference participant faces are obscured within the video streams. The best available video streams are output for rendering within separate user interface tiles of conferencing software.
    Type: Application
    Filed: November 21, 2023
    Publication date: March 14, 2024
    Inventors: Anna Deng, Yanjia Duan, Juntao Feng, Tianming Gu, Cynthia Eshiuan Lee, Bo Ling, Chong Lv, Jeffrey William Smith, Menglin Wang, Huixi Zhao, Xingguo Zhu
  • Publication number: 20240081523
    Abstract: A foldable device with a lifting mechanism includes at least one rail, a first sliding member, a second sliding member, a first linking member, a second linking member, and a latch structure. The first and the second sliding members are movably disposed on the rail, the first linking member is pivoted to the second sliding member, and the second linking member is pivoted to the first linking member and the first sliding member. The first and the second sliding members are combined with or departed from each other through a latch structure. The first and the second sliding members move closed to or away from each other to drive the first linking member to be folded onto or spread out from the rail when the first and the second sliding members are departed from each other.
    Type: Application
    Filed: August 14, 2023
    Publication date: March 14, 2024
    Inventor: Tsung-Ling Lee
  • Publication number: 20240087980
    Abstract: A semiconductor device includes a substrate, a dielectric layer disposed over the substrate, and an interconnect structure extending through the dielectric layer. The dielectric layer includes a low-k dielectric material which includes silicon carbonitride having a carbon content ranging from about 30 atomic % to about 45 atomic %. The semiconductor device further includes a thermal dissipation feature extending through the dielectric layer and disposed to be spaced apart from the interconnect structure.
    Type: Application
    Filed: February 17, 2023
    Publication date: March 14, 2024
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Kai-Fang CHENG, Cherng-Shiaw TSAI, Cheng-Chin LEE, Yen-Ju WU, Yen-Pin HSU, Li-Ling SU, Ming-Hsien LIN, Hsiao-Kang CHANG
  • Publication number: 20240081081
    Abstract: A ferroelectric memory device and a semiconductor die are provided. The ferroelectric memory device includes a gate electrode; a channel layer, overlapped with the gate electrode; source/drain contacts, in contact with separate ends of the channel layer; a ferroelectric layer, lying between the gate electrode and the channel layer; and a first insertion layer, extending in between the ferroelectric layer and the channel layer, and comprising a metal carbonitride or a metal nitride.
    Type: Application
    Filed: January 10, 2023
    Publication date: March 7, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ya-Ling Lee, Chung-Te Lin, Han-Ting Tsai, Wei-Gang Chiu, Yen-Chieh Huang, Ming-Yi Yang
  • Publication number: 20240075071
    Abstract: Disclosed in the present invention is an optimized cell transplant. The optimized cell transplant is formed by performing gene induction and modification on a mesenchymal stem cell in the form of a small molecule and protein composition. The expression levels of CD200 gene, Galectin-9 gene and VISTA gene can be increased synchronously after cell culture. Vector virus infection and plasmid transfection are not required in the cell preparation process, so that high biological safety and great clinical application value of cells are achieved.
    Type: Application
    Filed: November 23, 2022
    Publication date: March 7, 2024
    Inventors: Ruei-Yue Liang, Kai-Ling Zhang, Ming-Hsi Chuang, Po-Cheng Lin, Peggy Leh Jiunn Wong, Chia-Hsin Lee
  • Patent number: 11921597
    Abstract: One or more techniques and/or computing devices are provided for cross-platform replication. For example, a replication relationship may be established between a first storage endpoint and a second storage endpoint, where at least one of the storage endpoints, such as the first storage endpoint, lacks or has incompatible functionality to perform and manage replication because the storage endpoints have different storage platforms that store data differently, use different control operations and interfaces, etc. Accordingly, replication destination workflow, replication source workflow, and/or a proxy representing the first storage endpoint may be implemented at the second storage endpoint comprising the replication functionality.
    Type: Grant
    Filed: May 31, 2022
    Date of Patent: March 5, 2024
    Assignee: NetApp, Inc.
    Inventors: Atul Ramesh Pandit, Vijay M. Deshmukh, Michael Lee Federwisch, Ling Zheng, Kiyoshi James Komatsu, Rachita Kothiyal
  • Publication number: 20240071947
    Abstract: A semiconductor package including a ring structure with one or more indents and a method of forming are provided. The semiconductor package may include a substrate, a first package component bonded to the substrate, wherein the first package component may include a first semiconductor die, a ring structure attached to the substrate, wherein the ring structure may encircle the first package component in a top view, and a lid structure attached to the ring structure. The ring structure may include a first segment, extending along a first edge of the substrate, and a second segment, extending along a second edge of the substrate. The first segment and the second segment may meet at a first corner of the ring structure, and a first indent of the ring structure may be disposed at the first corner of the ring structure.
    Type: Application
    Filed: August 30, 2022
    Publication date: February 29, 2024
    Inventors: Yu-Ling Tsai, Lai Wei Chih, Meng-Tsan Lee, Hung-Pin Chang, Li-Han Hsu, Chien-Chia Chiu, Cheng-Hung Lin
  • Patent number: 11912619
    Abstract: A textured glass article includes: a body comprising an aluminosilicate glass comprising greater than or equal to 16 wt % Al2O3, the body having at least a first surface; and a plurality of polyhedral surface features extending from the first surface, each of the plurality of polyhedral surface features comprising a base on the first surface, a plurality of facets extending from the first surface, and a surface feature size at the base greater than or equal to 10 ?m and less than or equal to 350 ?m, wherein the plurality of facets of each polyhedral surface feature converge toward one another.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: February 27, 2024
    Assignee: CORNING INCORPORATED
    Inventors: Xinyu Cao, Christine Cecala, Ling Chen, Wanghui Chen, Yuhui Jin, Cameron Robert Nelson, Jayantha Senawiratne, David Lee Weidman