Abstract: A color adjusting method for a color light-emitting element is provided. Firstly, a first white light beam is produced by red, green and blue light-emitting units collaboratively, and a second white light beam is produced by a white light-emitting unit. Then, a second chromaticity value corresponding to the second white light beam is acquired. Then, the red, green and blue light-emitting units are controlled to produce a third white light beam according to the second chromaticity value, and a first adjusting parameter is acquired. Then, the white light-emitting unit is controlled to produce a fourth white light beam according to a third luminance value corresponding to the third white light beam, and a second adjusting parameter is acquired. Then, a gray level adjustment process is performed according to the first and second adjusting parameters.

Abstract: A data migration method and an apparatus are provided. The method is as follows: sending, by a first storage system, a location update request to a location server, where the location update request is used to indicate the location server to update location information of a first bucket from being located in a second storage system to being located in the first storage system (402); migrating data (405) in a first bucket from the second storage system; receiving a data access request, where the data access request is used to access the data (406) in the first bucket; and determining based on a type of the data access request and a migration status of the data, that the first storage system or the second storage system processes the data access request (407).

Abstract: A light-emitting device comprises a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first contact layer on the first semiconductor layer; a second contact layer on the second semiconductor layer, wherein the first contact layer and the second contact layer comprise a metal material other than gold (Au) or copper (Cu); a first pad on the semiconductor stack; a second pad on the semiconductor stack.

Abstract: The objective of the present invention is to provide an autonomous localization and navigation equipment which has the following advantages. The autonomous localization and navigation equipment is highly modularized, which greatly reduces the coupling degree with the host equipment, so the equipment is convenient to be integrated to the existing host equipment and it is flexibly expandable. Thus, the host equipment such as a robot etc. has a more concise and clear system constitution, thereby greatly reducing the development difficulty and developing time of the host equipment having the autonomous localization and navigation equipment 1. Moreover, as a result of the high degree of modularization of the autonomous localization and navigation equipment, it is possible to miniaturize the host equipment.

Abstract: A method includes identifying fingers of a first device and fingers of a second device. The method includes grouping the fingers of the first device into a first finger group and a second finger group, wherein the first finger group is electrically connected to the second finger group. The method further includes positioning the first finger group extends across a first doped region. The method further includes positioning the second finger group extends across a second doped region, wherein the second doped region has a same dopant type as the first doped region. The method further includes grouping the fingers of the second device into a third finger group and a fourth finger group, wherein the third finger group is electrically connected to the fourth finger group. The method further includes positioning the third finger group and the fourth finger group extending across the second doped region.

Abstract: In managing multiple versions of triggers, a database system creates a first version of a trigger to apply a first set of actions in response to a first triggering event. The database system also creates a second version of the trigger to apply a second set of actions to the database object in response to a second triggering event. Upon receiving a command to set the current version of the trigger to the second version, the database system sets the second version as the current version of the trigger. When the triggering event of the trigger occurs, the database system determines that the second version is the current version of the trigger, retrieves the second set of actions in the second version, and executes the second set of actions.

Abstract: A device includes a substrate, and a vertical inductor over the substrate. The vertical inductor includes a plurality of parts formed of metal, wherein each of the parts extends in one of a plurality of planes perpendicular to a major surface of the substrate. Metal lines interconnect neighboring ones of the plurality of parts of the vertical inductor.

Abstract: Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

Abstract: A light-emitting diode, includes a substrate; a semiconductor stack formed on the substrate; a first current blocking patterned structure and a second current blocking patterned structure formed on the semiconductor stack and separated from each other; and a plurality of electrodes formed on the semiconductor stack and electrically connected to the semiconductor stack; wherein the first current blocking patterned structure is overlapped with one of the plurality of electrodes and the second current blocking patterned structure is not overlapped with the plurality of electrodes.

Abstract: A fastener tool includes a motor, a drive mechanism connected to the motor and adapted to drive a piston, and a cylinder filled with high-pressure gas. The piston is accommodated in the cylinder and suitable for a reciprocating motion within the cylinder. The drive mechanism includes a blade fixed to the piston and a gear coupled to the motor. The gear contains a plurality of teeth adapted to engage with a plurality of lugs on the blade such that a rotation of the gear is transformed to a linear movement of the blade. The drive mechanism further includes a disengagement module which, within a period of a rotation cycle of the gear, is configured to prevent one of the plurality of teeth from unintentionally engaging with a misaligned one.

Abstract: The present subject matter relates to fabrication of micro-arc oxidation (MAO) based insert-molded components. In an example implementation, a method of fabricating a MAO based insert-molded component comprises forming an insert-molded component and oxidizing the insert-molded component through MAO. The insert-molded component has a metal body molded with a plastic body. On oxidation of the insert-molded component through MAO an oxide layer is formed on the metal body.

Abstract: A color adjusting method for a color light-emitting element is provided. Firstly, a first white light beam is produced by red, green and blue light-emitting units collaboratively, and a second white light beam is produced by a white light-emitting unit. Then, a second chromaticity value corresponding to the second white light beam is acquired. Then, the red, green and blue light-emitting units are controlled to produce a third white light beam according to the second chromaticity value, and a first adjusting parameter is acquired. Then, the white light-emitting unit is controlled to produce a fourth white light beam according to a third luminance value corresponding to the third white light beam, and a second adjusting parameter is acquired. Then, a gray level adjustment process is performed according to the first and second adjusting parameters.

Abstract: A method of detecting a workpiece jam condition in a pneumatic tool includes striking a workpiece by a blade of the tool, detecting whether a piston to which the blade is attached reaches a predetermined position within a predetermined time, and determining a workpiece jam condition has occurred if the piston does not reach the predetermined position within the predetermined time.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a single diffusion break (SDB) structure in the fin-shaped structure to divide the fin-shaped structure into a first portion and a second portion, and a gate structure on the SDB structure. Preferably, the SDB structure includes silicon oxycarbonitride (SiOCN), a concentration portion of oxygen in SiOCN is between 30% to 60%, and the gate structure includes a metal gate having a n-type work function metal layer or a p-type work function metal layer.

Abstract: A sealing film indenting device includes an indentation cutter pad, a movable rod movable relative to the indentation cutter pad along a moving axis, an indentation cutter mounted to the movable rod, and a drive unit. The drive unit is coupled to the movable rod for driving the movable rod to move along the moving axis between a standby position where a film lidding receiving space defined between the indentation cutter and the indentation cutter pad for receiving a film lidding to be indented, and an indentation cutting position where the indentation cutter moved toward the indentation cutter pad across the film lidding to cut indentations on the film lidding.

Abstract: Methods and apparatus for forming a semiconductor device package with a transmission line using a micro-bump layer are disclosed. The micro-bump layer may comprise micro-bumps and micro-bump lines, formed between a top device and a bottom device. A signal transmission line may be formed using a micro-bump line above a bottom device. A ground plane may be formed using a redistribution layer (RDL) within the bottom device, or using additional micro-bump lines. The RDL formed ground plane may comprise open slots. There may be RDLs at the bottom device and the top device above and below the micro-bump lines to form parts of the ground planes.

Abstract: A semiconductor light-emitting device includes a substrate; a first semiconductor layer and a second semiconductor layer formed on the substrate, wherein the first semiconductor layer includes a first exposed portion and a second portion; a plurality of first trenches formed on the substrate and including a surface composed by the first exposed portion; a second trench formed on the substrate and including a surface composed by the second exposed portion at a periphery region of the semiconductor light-emitting device, wherein each of the plurality of first trenches is branched from the second trench; and a patterned metal layer formed on the second semiconductor layer and including a first metal region and a second metal region, and portions of the second metal region are formed in the plurality of first trenches and the second trench to electrically connect to the first exposed portion and the second exposed portion.

Abstract: An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.

Abstract: The present invention relates to a monoclonal antibody that inhibits immunosuppressive functions of pathogens, antigen-binding fragment thereof, and hybridomas producing such antibody. The monoclonal antibody or antigen-binding fragment thereof bind to a peptide consisting an amino acid sequence represented by MEKVGKDGVITVE (SEQ ID NO: 1). The present invention also discloses use of the invented monoclonal antibody or antigen-binding fragment thereof, and method of preparation for such hybridomas.

Abstract: A semiconductor device includes a fin-shaped structure on a substrate, a single diffusion break (SDB) structure in the fin-shaped structure to divide the fin-shaped structure into a first portion and a second portion, and a gate structure on the SDB structure. Preferably, the SDB structure includes silicon oxycarbonitride (SiOCN), a concentration portion of oxygen in SiOCN is between 30% to 60%, and the gate structure includes a metal gate having a n-type work function metal layer or a p-type work function metal layer.