Patents by Inventor Ling Ping Ong

Ling Ping Ong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • INTEGRATED PLATED CIRCUIT HEAT SINK AND METHOD OF MANUFACTURE
    Publication number: 20130233600
    Abstract: A method of preparing a non-ferrous metal substrate for plating includes providing an anodized layer on an aluminum substrate and electrically isolating the anodized layer from the non-ferrous metal substrate by applying an electrically non-conductive micro-filler to the anodized layer to form a filled region of the anodized layer electrically isolating the anodized layer from the non-ferrous metal substrate.
    Type: Application
    Filed: June 16, 2011
    Publication date: September 12, 2013
    Applicant: ANOMAX SDN BHD
    Inventor: Ling Ping Ong