Patents by Inventor LING-QI YI

LING-QI YI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9040140
    Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.
    Type: Grant
    Filed: December 25, 2012
    Date of Patent: May 26, 2015
    Assignees: HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yong Li, Wen-Hsiung Chen, Shin-Wen Chen, Shu-Sheng Peng, Wen-Chang Chen, Yu-Tsan Cheng, Ling-Qi Yi, Li-Min Liu, Fu-Li Long, Fu-Chun Li
  • Publication number: 20140113097
    Abstract: A SMT tape includes a carrier tape, a number of separation pads, a number of workpieces, and a package tape. The carrier tape includes a package surface and defines a number of receiving grooves in the package surface and arranged along a length direction of the carrier tape. The separation pads are received in the receiving grooves and fixed to bottom surfaces of the receiving grooves respectively. Each separation pad includes a separation surface opposite to a bottom surface of the corresponding receiving groove and a number of protrusions protruding up from the separation surface. The workpieces are respectively received in the receiving grooves. Each workpiece includes a main body and an adhesive layer positioned between the corresponding separation pad and the main body. The package tape is adhered to the package surface and seals the receiving grooves.
    Type: Application
    Filed: December 25, 2012
    Publication date: April 24, 2014
    Applicants: HON HAI PRECISION INDUSTRY CO., LTD., HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
    Inventors: YONG LI, WEN-HSIUNG CHEN, SHIN-WEN CHEN, SHU-SHENG PENG, WEN-CHANG CHEN, YU-TSAN CHENG, LING-QI YI, LI-MIN LIU, FU-LI LONG, FU-CHUN LI