Abstract: An authenticating device is used for optically authenticating a testing area of a first surface of a valuable document. The valuable document defines a normal perpendicular to the first surface and a datum penetrating the normal and two sides of the valuable document. The datum and the first surface collectively define a first area and a second area adjacent to the first area. The authenticating device includes a first light emitting unit, a second light emitting unit, and a light receiving component. The first light emitting unit is arranged within the first area. The second light emitting unit is arranged within the first area. The light receiving component is arranged within the second area. The first light emitting unit and the second light emitting unit emit light to the testing area in sequence for authenticating the variable document.

Abstract: A zooming camera module includes a first lens group, a second lens group, and a third lens group. The first lens group is implemented on an optical axis at a fixed position, and has a negative total optical power. The second lens group is implemented on the optical axis and can be moved back and forth along the optical axis, to achieve zooming and focusing. The second lens group has a positive total optical power, and includes a liquid lens unit and at least one lens with non-zero optical power, wherein the at least one lens and the liquid lens are separately or integrally configured. The third lens group is implemented on the optical axis at a fixed position, and has a non-zero total optical power.

Abstract: An image sensor package includes a substrate, an image sensor chip, a plurality of metal wires and an encapsulant. The substrate has an upper face, a lower face and a plurality of connecting pads arranged on the upper face. The image sensor chip has an active surface, a back surface opposite to the active surface and a plurality of bonding pads arranged on the active surface. The metal wires electrically connect the bonding pads of the image sensor chip to the connecting pads of the substrate. The transparent cover is arranged above the image sensor chip. A gap is formed between the transparent cover and the image sensor chip. The encapsulant is disposed around the transparent cover and the metal wires, and is used for sealing the metal wires and fixing the transparent cover above the image sensor chip.

Abstract: A zooming camera module includes a first lens group, a second lens group, and a third lens group. The first lens group is implemented on an optical axis at a fixed position, and has a negative total optical power. The second lens group is implemented on the optical axis and can be moved back and forth along the optical axis, to achieve zooming and focusing. The second lens group has a positive total optical power, and includes a liquid lens unit and at least one lens with non-zero optical power, wherein the at least one lens and the liquid lens are separately or integrally configured. The third lens group is implemented on the optical axis at a fixed position, and has a non-zero total optical power.

Abstract: A scanning device with multifocus and multiresolution is provided. The scanning device is formed by the combination of the glass plate, the circuit boards, the rod lenses and the light-sensitive sensor arrays. Furthermore, since the relative positions of the circuit boards, the relative positions of the light-sensitive sensor arrays, the thicknesses of the light-sensitive sensors, the vertical distance between the glass plate and the light-sensitive sensor array, the thickness of the glass plate and the length of the glass plate are adjustable, the scanning device has the multifocus and multiresolution functions.

Abstract: A method of fabricating a CCDM scan module applied for image scan. A circuit board on which electronic devices are mounted is provided. A photo-detector and an integrated circuit device which is either packaged or unpackaged are also mounted on the circuit board to form an image sensor board. The electric connection between the photo-detector, the IC devices and the circuit board is established by wire-bonding technique. A module base is provided, and at least one reflection mirror and one transmission lens are mounted on the module base at predetermined positions. The image sensor board is then mounted on the module base at a position aligned with the lens for focusing an image.

Abstract: A scanning device with multifocus and multiresolution is provided. The scanning device is formed by the combination of the glass plate, the circuit boards, the rod lenses and the light-sensitive sensor arrays. Furthermore, since the relative positions of the circuit boards, the relative positions of the light-sensitive sensor arrays, the thicknesses of the light-sensitive sensors, the vertical distance between the glass plate and the light-sensitive sensor array, the thickness of the glass plate and the length of the glass plate are adjustable, the scanning device has the multifocus and multiresolution functions.

Abstract: A light source module structure for a CIS module of a scanner, a multi-function printer (MFP) or a copy machine is provided. The light source module structure includes a housing having a first circuit board therein; a light-sensing element disposed on the first circuit board and electrically connected to the first circuit board; a lens disposed in the housing and being parallel to the light-sensing element; and at least one organic electro luminescent element integration disposed in the housing to provide a light source.

Abstract: An organic light-emitting diode (OLED) comprises a transparent substrate, a first electrode, at least one organic functional layer, a second electrode, and a lid. The first electrode is disposed on the transparent substrate, the organic functional layer is disposed on the first electrode, the second electrode is disposed on the organic functional layer, and the lid is disposed above the second electrode. The lid has at least one heat-dissipating pin mounted on the lid. Furthermore, the lid is composed of a covering component and a heat-dissipating component. The covering component is disposed on or above the second electrode, and the heat-dissipating component is disposed on the covering component.