Patents by Inventor Ling Yin

Ling Yin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240182276
    Abstract: The present application relates to a stopping method and apparatus for a device with a hoisting mechanism and a crane. The method includes: generating a displacement change rate according to position offset information of a hoisting handle of the device when the position offset information meets a triggering condition; comparing the displacement change rate with a preset threshold to generate a stopping control instruction; and controlling an overhead system of the device to perform deceleration stopping according to the stopping control instruction. The stopping method and apparatus for the device with the hoisting mechanism, the crane, the electronic device and the computer readable medium involved in the present application may achieve the purpose of rapid stopping control only through the hoisting handle of the device, and reduce the requirement for the driver's reaction time and increase the safety of the device when emergency stopping is required.
    Type: Application
    Filed: April 1, 2022
    Publication date: June 6, 2024
    Applicant: Zoomlion Heavy Industry Science and Technology Co., Ltd.
    Inventors: Biao OU, Ling FU, Xiaoying YU, Yanbin LIU, Wenkun LONG, Qiang HE, Li YIN
  • Patent number: 12002747
    Abstract: An electronic device and associated methods are disclosed. In one example, the electronic device can include a semiconductor package including a package substrate, a first semiconductor die on the package substrate, a second semiconductor die on the package substrate, a third semiconductor die on the package substrate, and a bridge interconnect at least partially embedded in the package substrate. The bridge interconnect can include a first bridge section coupling the first semiconductor die to the second semiconductor die, a second bridge section coupling the second semiconductor die to the third semiconductor die, and a power-ground section between the first section and the second section, the power-ground section comprising first and second conductive traces coupled to the second semiconductor die.
    Type: Grant
    Filed: February 25, 2022
    Date of Patent: June 4, 2024
    Assignee: Intel Corporation
    Inventors: Bok Eng Cheah, Jenny Shio Yin Ong, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong
  • Publication number: 20240173859
    Abstract: A method for compensating boom deflection comprising: determining a joint angle set of a boom if an end of the boom were to reach a predetermined target position when viewed as a rigid body, wherein the joint angle set comprises an angle of each joint of the boom; determining an actual position that the joint angle set causes the end to reach; determining the deviation between the actual and predetermined target positions; and when the deviation does not satisfy a predetermined condition, continuing to adjust the joint angle set until the deviation satisfies the predetermined condition. The end of the boom can consequently more accurately reach the predetermined target position. The present invention further relates to a method for controlling a boom, an apparatus for compensating boom deflection, an apparatus for controlling a boom, a construction machine, and a computer-readable storage medium.
    Type: Application
    Filed: March 23, 2022
    Publication date: May 30, 2024
    Applicant: ZOOMLION HEAVY INDUSTRY SCIENCE AND TECHNOLOGY CO., LTD.
    Inventors: Ling FU, Haojie PI, Yanbin LIU, Li YIN, Lingjuan SHE, Xiaoying YU
  • Publication number: 20240145368
    Abstract: The present disclosure is directed to an electronic assembly and method of forming thereof. The electronic assembly may include a package substrate with a top substrate surface and an interposer coupled to the package substrate at the top substrate surface. The interposer may include a plurality of through interposer vias and an opening extending through the interposer. A power module may be arranged in the opening in the interposer and coupled to the package substrate at the top substrate surface. The power module may include a plurality of interconnects including a first interconnect coupled to a first voltage and a second interconnect coupled to a second voltage.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventors: Jackson Chung Peng KONG, Bok Eng CHEAH, Seok Ling LIM, Jenny Shio Yin ONG, Ravindra RUDRARAJU, Vijay KASTURI
  • Publication number: 20240145365
    Abstract: A device is provided, including a dielectric layer, a plurality of first conductive segments within the dielectric layer and spaced apart from each other by respective first spacings, and a plurality of second conductive segments within the dielectric layer and spaced apart from each other by respective second spacings. The plurality of second conductive segments may be over and spaced apart from the plurality of first conductive segments by the dielectric layer. A respective one of the first conductive segments may at least partially extend across a corresponding one of the second spacings, and a respective one of the second conductive segments may at least partially extend across a corresponding one of the first spacings.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventors: Bok Eng CHEAH, Seok Ling LIM, Jenny Shio Yin ONG, Kooi Chi OOI, Jackson Chung Peng KONG
  • Publication number: 20240145420
    Abstract: The present disclosure generally relates to an electronic assembly. The electronic assembly may include a substrate including a plurality of first contact pads, a plurality of second contact pads, and a plurality of third contact pads. The electronic assembly may include a first device including a first footprint coupled to the substrate at a first surface. The electronic assembly may include a frame arranged between the first device and the substrate, the frame including a dielectric material, the frame further including a main frame extending around the first device, and further including a plurality of sub-frames encircling the plurality of first contact pads and the plurality of second contact pads on the substrate, wherein the frame may further include a conductive layer extending at least partially across the main frame.
    Type: Application
    Filed: October 28, 2022
    Publication date: May 2, 2024
    Inventors: Bok Eng CHEAH, Seok Ling LIM, Kooi Chi OOI, Jackson Chung Peng KONG, Jenny Shio Yin ONG
  • Publication number: 20240136269
    Abstract: A device is provided, including a package substrate including at least one opening extending through the package substrate, and an interconnect structure including a first segment and a second segment. The first segment may extend under a bottom surface of the package substrate and may further extend beyond a footprint of the package substrate. The second segment may extend vertically from the first segment and may extend at least partially through the at least one opening of the package substrate.
    Type: Application
    Filed: October 18, 2022
    Publication date: April 25, 2024
    Inventors: Bok Eng CHEAH, Seok Ling LIM, Jenny Shio Yin ONG, Jackson Chung Peng KONG, Kooi Chi OOI
  • Patent number: 11955431
    Abstract: Semiconductor packages, and methods for making the semiconductor packages, having an interposer structure with one or more interposer and an extension platform, which has an opening for placing the interposer, and the space between the interposer and the extension platform is filled with a polymeric material to form a unitary interposer-extension platform composite structure. A stacked structure may be formed by at least a first semiconductor chip coupled to the interposer and at least a second semiconductor chip coupled to the extension platform, and at least one bridge extending over the space that electrically couples the extension platform and the interposer. The extension platform may include a recess step section that may accommodate a plurality of passive devices to reduced power delivery inductance loop for the high-density 2.5D and 3D stacked packaging applications.
    Type: Grant
    Filed: August 7, 2020
    Date of Patent: April 9, 2024
    Assignee: Intel Corporation
    Inventors: Jenny Shio Yin Ong, Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Saravanan Sethuraman
  • Publication number: 20240111956
    Abstract: Disclosed are a Nested Named Entity Recognition method based on part-of-speech awareness, system, device and storage medium therefor. The method uses a BiLSTM model to extract a feature of text word data in order to obtain a text word depth feature, and each text word of text to be recognized is initialized into a corresponding graph node, and a text heterogeneous graph of the text to be recognized is constructed according to a preset part-of-speech path, the text word data of the graph nodes is updated by an attention mechanism, and the features of all graph nodes of the text heterogeneous graph are extracted using the BiLSTM model, and a nested named entity recognition result is obtained after decoding and annotating. The present disclosure can recognize ordinary entities and nested entities accurately and effectively, and enhance the performance and advantages of the nested named entity recognition model.
    Type: Application
    Filed: November 28, 2023
    Publication date: April 4, 2024
    Inventors: Jing Qiu, Ling Zhou, Chengliang Gao, Rongrong Chen, Ximing Chen, Zhihong Tian, Lihua Yin, Hui Lu, Yanbin Sun, Junjun Chen, Dongyang Zheng, Fei Tang, Jiaxu Xing
  • Patent number: 11935283
    Abstract: Disclosed are a cranial CT-based grading method and a corresponding system, which relate to the field of medical imaging. The cranial CT-based grading method as disclosed solves the problems of relatively great subjective disparities and poor operability in eye-balling ASPECTS assessment. The grading method includes: determining frames where target image slices are located from to-be-processed multi-frame cranial CT data; extracting target areas; performing infarct judgment on each target area included in the target areas to output an infarct judgment outcome regarding the target area; and outputting a grading outcome based on infarct judgment outcomes regarding all target areas.
    Type: Grant
    Filed: November 14, 2019
    Date of Patent: March 19, 2024
    Assignee: UNION STRONG (BEIJING) TECHNOLOGY CO. LTD.
    Inventors: Hailan Jin, Ling Song, Yin Yin, Guangming Yang, Yangyang Yao, Pengxiang Li, Lan Qin
  • Publication number: 20240071934
    Abstract: The present disclosure is directed to semiconductor packages incorporating composite or hybrid bridges that include first and second interconnect bridges positioned on a substrate and a power corridor with a plurality of vertical channels positioned on the substrate between the first and second interconnect bridges, wherein the power corridor integrally joins the first interconnect bridge to the second interconnect bridge.
    Type: Application
    Filed: August 24, 2022
    Publication date: February 29, 2024
    Inventors: Bok Eng CHEAH, Jenny Shio Yin ONG, Jackson Chung Peng KONG, Seok Ling LIM
  • Publication number: 20240071856
    Abstract: The present disclosure is directed to an electronic assembly and method of forming thereof. The electronic assembly may include a substrate and a first die with first and second opposing surfaces. The first die may be coupled to the substrate at the first surface. At least one first trench may extend partially through the first die from the second surface. A stiffener may be attached to the substrate. The stiffener may have a cavity that accommodates the first die, in which the second surface of the first die faces the stiffener. A thermally conductive layer may be positioned between the stiffener and the first die. The conductive layer at least partially fills the at least one first trench.
    Type: Application
    Filed: August 25, 2022
    Publication date: February 29, 2024
    Inventors: Bok Eng CHEAH, Seok Ling LIM, Jenny Shio Yin ONG, Jackson Chung Peng KONG, Kooi Chi OOI
  • Publication number: 20220205967
    Abstract: A gas sensor network system provides near real-time monitoring of fugitive emissions of VOC compounds in chemical plants and facilities. The present disclosure provides a sensor placement method which determines where to place sensors within a facility. The sensor placement method includes obtaining plant layout, gas composition, meteorological conditions and/or other types of information regarding a facility, determining the types of gas and ancillary sensors needed, and generating the minimum detection distances required based on the sensitivities of the sensors to the gas compounds involved. And, then calculating the minimal number of sensors required for each sensor type with optimized sensor locations to ensure best coverage of potentially leaking components within the facility.
    Type: Application
    Filed: May 22, 2020
    Publication date: June 30, 2022
    Applicants: MOLEX, LLC, UNITED STATES ENVIRONMENTAL PROTECTION AGENCY
    Inventors: Eben Daniel THOMA, Alexander S. CHERNYSHOV, Wenfeng PENG, Ling-Yin LIN, Jingxue XU
  • Publication number: 20220044335
    Abstract: A friend recommendation method oriented towards subway passengers is disclosed, including: obtaining the source data associated with subway station passengers and subway operation; preprocessing the obtained source data; estimating passenger travel paths according to the preprocessed source data; calculating a detailed train operation timetable based on the subway train timetable and train departure intervals; matching each passenger to a specific train based on the estimated passenger travel paths and calculated train operation timetable; and extracting and measuring the interactions between passengers based on the matched passengers and specific trains, and accordingly making a friend recommendation. A friend recommendation system oriented towards subway passengers is further disclosed.
    Type: Application
    Filed: October 21, 2021
    Publication date: February 10, 2022
    Inventors: LING YIN, FAN ZHANG, KANG LIU
  • Patent number: 10935468
    Abstract: A compact testing module (1) for use in dynamic characteristics experiments of hydraulic damper valve under extreme high or low temperature conditions, an automated system and approach based on the compact testing module (1). The compact testing module (1) comprises an outer cylinder assembly (2), a guide seat assembly (3), a foam/air separator for guide seat (4), an inner cylinder (5), a piston-and-rod assembly (6), fluids (7), a foot valve assembly (8), a washer for inner cylinder (9), a washer for foot valve assembly (10), a fluid-guiding structure (11), a magnet (12), a fluid-returning assembly (13), a framework oil seal (14), a screw cover (15) and a dust wiper (16). Based on the integrated design principle, the compact testing module (1) allows the fluids (7), the pressure fluid supplier, the hydraulic damper valve being tested (32), the pressure sensors be all integrated in one component.
    Type: Grant
    Filed: September 11, 2018
    Date of Patent: March 2, 2021
    Assignees: DONGGUAN UNIVERSITY OF TECHNOLOGY, Zhuzhou Lince Group Shock Absorber Co., Ltd
    Inventors: Wenlin Wang, Youquan Fan, Moujun Dai, Zirong Zhou, Ling Yin
  • Publication number: 20200378869
    Abstract: A compact testing module (1) for use in dynamic characteristics experiments of hydraulic damper valve under extreme high or low temperature conditions, an automated system and approach based on the compact testing module (1). The compact testing module (1) comprises an outer cylinder assembly (2), a guide seat assembly (3), a foam/air separator for guide seat (4), an inner cylinder (5), a piston-and-rod assembly (6), fluids (7), a foot valve assembly (8), a washer for inner cylinder (9), a washer for foot valve assembly (10), a fluid-guiding structure (11), a magnet (12), a fluid-returning assembly (13), a framework oil seal (14), a screw cover (15) and a dust wiper (16). Based on the integrated design principle, the compact testing module (1) allows the fluids (7), the pressure fluid supplier, the hydraulic damper valve being tested (32), the pressure sensors be all integrated in one component.
    Type: Application
    Filed: September 11, 2018
    Publication date: December 3, 2020
    Inventors: Wenlin Wang, Youquan Fan, Moujun Dai, Zirong Zhou, Ling Yin
  • Publication number: 20190092939
    Abstract: This invention discloses an anti-UV plastic for automobile interior ornaments. The anti-UV plastic for automobile interior ornaments includes PC resin, ABS resin, antioxygen, pentaerythritol stearate, inorganic filler, anti-UV fiber, organic silicon resin or modified organic silicon resin. Except maintaining the properties of ABS resin and PC resin, the anti-UV plastic for automobile interior ornaments has excellent mechanical properties and thermal properties, and can reduce the maintenance cost of automobile interior ornaments caused by UV aging. In addition, the anti-UV plastic for automobile interior ornaments owns favorable machining properties, and can be machined into automobile interior ornaments of various shapes.
    Type: Application
    Filed: June 11, 2018
    Publication date: March 28, 2019
    Inventors: Naitian Zhang, Bin Chen, Rongfu Zhang, Ling Yin
  • Patent number: 8268272
    Abstract: A method for removing vinyl monomers from a gas stream comprises steps of: irradiating a photoactive-inorganic medium by a light emitting unit to activate the photoactive-inorganic medium; and pumping a gas stream including vinyl monomers to contact with the activated photoactive-inorganic medium to make the vinyl monomers in the gas stream to polymerize on the photoactive-inorganic medium to jointly form a polymeric nano-composite.
    Type: Grant
    Filed: October 18, 2011
    Date of Patent: September 18, 2012
    Assignee: National Pingtung University Of Science & Technology
    Inventors: Wu-Jang Huang, Ling-Yin Chang, Yen-Chia Liu, Hsiu-Hsien Wu, Yi-Ching Li
  • Publication number: 20120035295
    Abstract: A method for removing vinyl monomers from a gas stream comprises steps of: irradiating a photoactive-inorganic medium by a light emitting unit to activate the photoactive-inorganic medium; and pumping a gas stream including vinyl monomers to contact with the activated photoactive-inorganic medium to make the vinyl monomers in the gas stream to polymerize on the photoactive-inorganic medium to jointly form a polymeric nano-composite.
    Type: Application
    Filed: October 18, 2011
    Publication date: February 9, 2012
    Inventors: Wu-jang HUANG, Ling-Yin Chang, Yen-Chia Liu, Hsiu-Hsien Wu, Yi-Ching Li
  • Publication number: 20100111798
    Abstract: An apparatus for removing vinyl monomers from a gas stream includes a tube, a shading casing and a light emitting unit. The tube includes a first section having a connecting port with an opening, a second section, and a third section having an outlet. The three sections sequentially link together, with the second section connecting between the first section and the third section. A photoactive-inorganic medium is arranged inside the second section. The shading casing surrounds and seals the second section and an inner surface of the shading casing defines a reflecting face. The light emitting unit is mounted to the shading casing to irradiate and activate the photoactive-inorganic medium in the second section. Accordingly, the photoactive-inorganic medium can be activated by the light emitting unit to photocatalyze vinyl monomers in a gas stream to polymerize on surfaces of the photoactive-inorganic medium, such that vinyl monomers are removed.
    Type: Application
    Filed: March 11, 2009
    Publication date: May 6, 2010
    Inventors: Wu-Jang HUANG, Ling-Yin CHANG, Yen-Chia LIU, Hsiu-Hsien WU, Yi-Ching Li