Patents by Inventor LING-YUEH YANG

LING-YUEH YANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microelectronic 3D packaging structure and method of manufacturing the same
    Patent number: 9288907
    Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: March 15, 2016
    Assignee: NATIONAL CHUNG SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Shao-Chung Hu, Kuo-Yang Horng, Ling-Yueh Yang, Wei-Ching Liu, Pen-Shan Chao, Kun-Feng Chen, Louis Lu-Chen Hsu
  • MICROELECTRONIC 3D PACKAGING STRUCTURE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150271921
    Abstract: A microelectronic 3D packaging structure and a method of manufacturing the same are introduced. The microelectronic 3D packaging structure includes a first board with a plurality of a first edges and disposed with a first electronic device; a second board with a plurality of a second edges and disposed with a second electronic device, wherein at least one second edge of the second board is jointed to at least one first edge of the first board to form a joint line; and a joint connection portion disposed at the joint line of the two adjacent boards and adapted to function as a connection path for transmitting signals.
    Type: Application
    Filed: March 18, 2014
    Publication date: September 24, 2015
    Applicant: CHUNG-SHAN INSTITUTE OF SCIENCE AND TECHNOLOGY ARMAMENTS BUREAU, M.N.D.
    Inventors: SHAO-CHUNG HU, KUO-YANG HORNG, LING-YUEH YANG, WEI-CHING LIU, PEN-SHAN CHAO, KUN-FENG CHEN, LOUIS LU-CHEN HSU