Patents by Inventor Lingchao Deng

Lingchao Deng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Glue dispensing method and circuit board
    Patent number: 10834826
    Abstract: A glue dispensing method includes making a glue dispensing hole in a processing region. The processing region is a region that is in a surface mount region corresponding to the surface mount component and in which no electronic circuit and pad exist. The method also includes welding the surface mount component onto the circuit board. The method further includes injecting glue into the glue dispensing hole, to fill a gap between the surface mount component and the circuit board, and placing the circuit board still, to wait for curing of the glue.
    Type: Grant
    Filed: February 25, 2016
    Date of Patent: November 10, 2020
    Assignee: Huawei Technologies Co., Ltd.
    Inventor: Lingchao Deng
  • GLUE DISPENSING METHOD AND CIRCUIT BOARD
    Publication number: 20190059159
    Abstract: A glue dispensing method includes making a glue dispensing hole in a processing region. The processing region is a region that is in a surface mount region corresponding to the surface mount component and in which no electronic circuit and pad exist. The method also includes welding the surface mount component onto the circuit board. The method further includes injecting glue into the glue dispensing hole, to fill a gap between the surface mount component and the circuit board, and placing the circuit board still, to wait for curing of the glue.
    Type: Application
    Filed: February 25, 2016
    Publication date: February 21, 2019
    Inventor: Lingchao Deng