Patents by Inventor LINGCHENG YUAN

LINGCHENG YUAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194562
    Abstract: This application provides a die package structure including a package substrate, a die, and a first package body. The package substrate has a first surface and a second surface opposite each other. The die is coupled to the package substrate, and the die has a hotspot. A heat dissipation connection point is disposed on the first surface of the package substrate, and a heat conduction channel that communicates the heat dissipation connection point with the hotspot is formed in the package substrate. A first connection terminal for connecting to an external device is disposed on the second surface. The first package body is disposed on the first surface, a heat conduction structure is formed in the first package body, and the heat conduction structure extends from the heat dissipation connection point to a surface of the first package body.
    Type: Application
    Filed: December 17, 2023
    Publication date: June 13, 2024
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventors: Le Kang, Xiaoguo Liu, Lingcheng Yuan, Bin Xu, Zhiqiang He
  • Patent number: 11002813
    Abstract: A gradient coil assembly of a magnetic resonance imaging system includes at least one gradient coil, a cooling arrangement for cooling the gradient coil, and an RF shield. The cooling arrangement includes at least one cooling tube that is configured to transport a cooling fluid and which is disposed on and in thermal contact with the gradient coil, wherein the assembly further comprises a thermal connector arrangement with at least one of a first thermal connector disposed between the RF shield and the at least one cooling tube, which provides a radially extending connection between the RF shield and the at least one cooling tube.
    Type: Grant
    Filed: February 21, 2018
    Date of Patent: May 11, 2021
    Assignee: Koninklijke Philips N.V.
    Inventors: Jun Pan, Lingcheng Yuan, Jian Lin, Yun Zhou
  • Publication number: 20200057127
    Abstract: The invention relates to cooling a gradient coil (3) of a magnetic resonance imaging system (11). It is an object of the invention to provide an improved assembly of a magnetic resonance imaging apparatus with a gradient coil (3) which allows a cooling of the gradient coil (3) in such a way that a better homogeneity of the temperature distribution an reduced hot spots effects can be achieved.
    Type: Application
    Filed: February 21, 2018
    Publication date: February 20, 2020
    Inventors: JUN PAN, LINGCHENG YUAN, JIAN LIN, YUN ZHOU