Patents by Inventor Lingfeng SHEN

Lingfeng SHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210325312
    Abstract: An analytical substrate including a substrate of which at least a first surface includes a dielectric or a semiconductor, and a metal film on the first surface of the substrate, and which includes protruding portions and protruding portions, in which the height of apex portions of the protruding portions is the height of a peak that is the greatest distance from the substrate in the surface height distribution of the metal film; the height of apex portions of the protruding portions is the height of a peak that is the next greatest distance from the substrate in the surface height distribution of the metal film; and the average value of the width of the protruding portions excluding groove regions, in which the height of the peak is the smallest distance from the substrate is at most equal to 200 nm.
    Type: Application
    Filed: September 11, 2019
    Publication date: October 21, 2021
    Inventors: Kei SHINOTSUKA, Lingfeng SHEN, Kotaro DAI, Hisako TOKUNO, Koki HONGO, Eriko ENDO
  • Patent number: D1029036
    Type: Grant
    Filed: September 5, 2022
    Date of Patent: May 28, 2024
    Assignee: Keeson Technology Corporation Limited
    Inventors: Huafeng Shan, Xiaodong Shou, Yifan Ma, Qi Shen, Jijia Liu, Mengjie Su, Lingfeng Yu, Xintao Shen, Wenchao Jin