Patents by Inventor Linghe Sui

Linghe Sui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • VAPOR CHAMBER FOR DUAL CAVITY HEAT SOURCES
    Publication number: 20230207424
    Abstract: A vapor chamber architecture for multiple cavity/heat source system designs. The vapor chamber architecture can be customized in dimensions to cool two or more spatially separated, and potentially heterogeneous, heat sources in a system floor plan. The vapor chamber architecture can additionally be customized to concurrently manage the cooling requirements for the two or more heat sources that have different power consumptions and sizes. The provided vapor chamber architecture can be manufactured using etching processes, additive manufacturing processes, or the like.
    Type: Application
    Filed: December 22, 2022
    Publication date: June 29, 2023
    Applicant: Intel Corporation
    Inventors: Linghe Sui, Jun Liu, Jiancheng Tao, Tao Wang, Chunlin Bai, Hongjun She, Dengfeng Huang