Abstract: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material.

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.

Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 40 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises ether in the backbone thereof.

Abstract: The present invention provides a one-part thermal-curing acrylate adhesive precursor, calculated by 100 wt. % of said one-part thermal-curing acrylate adhesive precursor, comprising: 20 to 85 wt. % of polyurethane modified acrylate oligomer; 5 to 25 wt. % of methacrylic acid; 5 to 65 wt. % of acrylate monomer; 0.5 to 5 wt. % of adhesion promoter; and 1 to 12 wt. % of initiator. The present invention also provides a preparation method for said one-part thermal-curing acrylate adhesive precursor. According to the technical scheme of the present invention, a one-part acrylate adhesive precursor with excellent adhesive properties, which can be thermal-cured, is provided.