Patents by Inventor Lingjie Tong

Lingjie Tong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250043164
    Abstract: The present invention provides a single-component epoxy adhesive composition and a preparation method thereof. The single-component epoxy adhesive composition comprises, based on the total weight thereof as 100 wt %: 42-67 wt % of an epoxy resin without a benzene ring structure; 32-57 wt % of a polymercaptan; and 0.1-12 wt % of an initiator. The single-component epoxy adhesive composition according to a technical solution of the invention has high light transmittance after curing, long time available for construction, good adhesion, and in particular good weather resistance (yellowing resistance), and is suitable for electronic industrial assembly, and especially for the assembly and sealing of electronic display devices.
    Type: Application
    Filed: December 1, 2022
    Publication date: February 6, 2025
    Inventors: Lingjie Tong, Jiaxing Sun
  • Publication number: 20240228839
    Abstract: The present invention provides a two-component thermally conductive adhesive composition and a two-component thermally conductive gap-filling glue. The composition comprises: 8-38 wt % of an acrylate monomer or a combination of an acrylate monomer and an acrylate oligomer, with a glass transition temperature ranging from ?80° C. to ?10° C.: 0.2-4 wt % of a peroxide oxidant: 0.05-1 wt % of a peroxide decomposition promoter; and 60-90 wt % of a thermally conductive filler, wherein the two-component thermally conductive adhesive composition comprises Part A and Part B. Part A comprises a peroxide oxidant and Part B comprises a peroxide decomposition promoter: the acrylate monomer, or the combination of the acrylate monomer and the acrylate oligomer, and the thermally conductive filler exist in one or both of Part A and Part B.
    Type: Application
    Filed: June 16, 2021
    Publication date: July 11, 2024
    Inventors: Lingjie Tong, Xiaohai Sheng, Ahmad Shaaban
  • Publication number: 20220243102
    Abstract: The present disclosure relates to a curable precursor of an adhesive composition, comprising: a) a (meth)acrylate-based (co)polymer base component comprising the free-radical (co)polymerization reaction product of a (co)polymerizable material comprising: i. C1-C32 acrylic acid ester monomer units; ii. optionally, C1-C18 methacrylic acid ester monomer units; and iii. optionally, ethylenically unsaturated monomer units having a functional group and which are copolymerizable with monomer units (i) and/or (ii); b) a crosslinker for the (meth)acrylate-based (co)polymer base component, which comprises at least one acid-functional group derived from phosphoric acid and at least one free-radical (co)polymerizable reactive group; c) a polyether oligomer having a number average molecular weight of at least 2000 g/mol and which comprises at least one free-radical (co)polymerizable reactive group; and d) a thermally conductive particulate material.
    Type: Application
    Filed: April 22, 2020
    Publication date: August 4, 2022
    Inventors: Ahmad Shaaban, Adrian Jung, Manfred Ludsteck, Adrian Eckert, Li Yao, Simon Plugge, Lingjie Tong
  • Publication number: 20220162376
    Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 20 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises an ether in the backbone thereof.
    Type: Application
    Filed: March 25, 2019
    Publication date: May 26, 2022
    Inventors: Li Yao, Michael A. Kropp, Matthew J. Kryger, Wayne S. Mahoney, Mario A. Perez, Shuang Wu, Lingjie Tong, Ahmad Shaaban, Adrian T. Jung, Jeremy M. Higgins, Ying Lin
  • Publication number: 20220153987
    Abstract: A curable composition includes a first part comprising an epoxy resin; and a second part comprising a multifunctional, functional thiol containing compound. The curable composition further includes an inorganic filler present in an amount of at least 40 weight %, based on the total weight of the curable composition. The multifunctional, functional thiol containing compound comprises ether in the backbone thereof.
    Type: Application
    Filed: December 13, 2019
    Publication date: May 19, 2022
    Inventors: Lingjie Tong, Yuan Zhao, Li Yao, Shuang Wu, Xiaohai Sheng, Xinxin Sun, Ahmad Shaaban, Menghuang Feng
  • Publication number: 20200270480
    Abstract: The present invention provides a one-part thermal-curing acrylate adhesive precursor, calculated by 100 wt. % of said one-part thermal-curing acrylate adhesive precursor, comprising: 20 to 85 wt. % of polyurethane modified acrylate oligomer; 5 to 25 wt. % of methacrylic acid; 5 to 65 wt. % of acrylate monomer; 0.5 to 5 wt. % of adhesion promoter; and 1 to 12 wt. % of initiator. The present invention also provides a preparation method for said one-part thermal-curing acrylate adhesive precursor. According to the technical scheme of the present invention, a one-part acrylate adhesive precursor with excellent adhesive properties, which can be thermal-cured, is provided.
    Type: Application
    Filed: July 6, 2018
    Publication date: August 27, 2020
    Inventor: Lingjie Tong