Abstract: System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.

Abstract: Embodiments of the present invention provide a computer-implemented method for identifying a specified object. The method includes collecting attributes of a physical object within a physical space, in which the attributes include an object temperature obtained via an (IR) sensor and an object shape obtained via an image sensor. A machine learning algorithm is executed to allocate a coordinate to the object based on the attributes. In response to a request from a user to locate the object, the physical space is scanned via the IR sensor and the image sensor to identify the object and to detect a present location. An indication of a location of the object is then displayed to the user, in which the indication is at least one of the present location of the object or a predicted location of the object.

Abstract: Embodiments of the present invention provide a computer-implemented method for identifying a specified object. The method includes collecting attributes of a physical object within a physical space, in which the attributes include an object temperature obtained via an (IR) sensor and an object shape obtained via an image sensor. A machine learning algorithm is executed to allocate a coordinate to the object based on the attributes. In response to a request from a user to locate the object, the physical space is scanned via the IR sensor and the image sensor to identify the object and to detect a present location. An indication of a location of the object is then displayed to the user, in which the indication is at least one of the present location of the object or a predicted location of the object.

Abstract: System and methods for solder void analysis with an optical inspection component are described, including a plurality of optical fibers longitudinally disposed through a glass tube such that ends of the optical fibers are exposed from corresponding ends of the glass tube. A solderable fill encompassing each of the optical fibers by filling spaces between each of the optical fibers and between the optical fibers and the glass tube such that the ends of the glass tube include the ends of the optical fibers surrounded by the solderable fill to form an interface around the optical fibers for soldering one of the ends of the glass tube to a solder pad.