Abstract: A wafer level packaging structure of a high-pixel image sensor chip comprises an image sensor chip, a supporting substrate and a light-transmitting substrate, the image sensor chip comprises a base, a sensing region formed on a first surface of the base; the supporting substrate is attached to the first surface of the base and provided with a first opening penetrating through the supporting substrate at a position corresponding to the sensing region, and the sensing region is exposed from a bottom of the first opening; and the light-transmitting substrate is fixed on a first surface plane of the supporting substrate and covers a top of the first opening, and two surface planes of the light-transmitting substrate are parallel with a plane on which the sensing region is located.