Patents by Inventor Lingqi LU

Lingqi LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-resolution processing method for seismic data based on inverse multi-resolution singular value decomposition
    Patent number: 11372122
    Abstract: A high-resolution processing method for seismic data based on inverse multi-resolution singular value decomposition includes the steps of: step 1: obtaining a single-trace seismic signal X as a raw signal; step 2: decomposing the seismic signal by using MRSVD algorithm to obtain a series of detailed singular values and inversely recursing the detailed singular values layer by layer to obtain a new detailed signal and an approximate signal; and step 3: sequentially superimposing the new detailed signal on the raw signal, layer by layer, to compensate the high-frequency component of the seismic signal so as to obtain a high-resolution seismic signal.
    Type: Grant
    Filed: January 18, 2020
    Date of Patent: June 28, 2022
    Assignee: Chengdu University of Technology
    Inventors: Hui Chen, Lingqi Lu, Ying Hu, Xuping Chen, Youhua Wei, Ke Guo, Hongyan Qian
  • High-Resolution Processing Method For Seismic Data based on Inverse Multi-Resolution Singular Value Decomposition
    Publication number: 20200233108
    Abstract: A high-resolution processing method for seismic data based on inverse multi-resolution singular value decomposition includes the steps of: step 1: obtaining a single-trace seismic signal X as a raw signal; step 2: decomposing the seismic signal by using MRSVD algorithm to obtain a series of detailed singular values and inversely recursing the detailed singular values layer by layer to obtain a new detailed signal and an approximate signal; and step 3: sequentially superimposing the new detailed signal on the raw signal, layer by layer, to compensate the high-frequency component of the seismic signal so as to obtain a high-resolution seismic signal.
    Type: Application
    Filed: January 18, 2020
    Publication date: July 23, 2020
    Inventors: Hui CHEN, Lingqi LU, Ying HU, Xuping CHEN, Youhua WEI, Ke GUO, Hongyan QIAN