Patents by Inventor Lingtao Liu

Lingtao Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Effective heat conduction from hotspot to heat spreader through package substrate
    Patent number: 11502017
    Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.
    Type: Grant
    Filed: December 10, 2018
    Date of Patent: November 15, 2022
    Assignee: Intel Corporation
    Inventors: Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha, Kyu-oh Lee
  • Heating of Thermo-Optic Device
    Publication number: 20210318561
    Abstract: A method may include: forming a base layer on a substrate; forming a waveguide assembly on the base layer, where the waveguide assembly is surrounded by a cladding layer; forming a trench opening through the cladding layer and the base layer; forming an undercut void by etching the substrate through the trench opening, where the undercut void extends under the waveguide assembly and the base layer; and filling the trench opening with a filler to seal off the undercut void. Other embodiments are described and claimed.
    Type: Application
    Filed: June 25, 2021
    Publication date: October 14, 2021
    Inventors: Meer Nazmus Sakib, Saeed Fathololoumi, Harel Frish, John Heck, Eddie Bononcini, Reece Defrees, Stanley J. Dobek, Aliasghar Eftekhar, Walter Garay, Lingtao Liu, Wei Qian
  • EFFECTIVE HEAT CONDUCTION FROM HOTSPOT TO HEAT SPREADER THROUGH PACKAGE SUBSTRATE
    Publication number: 20200185300
    Abstract: An integrated circuit (IC) package comprises a substrate comprising a dielectric and a thermal conduit that is embedded within the dielectric. The thermal conduit has a length that extends laterally within the dielectric from a first end to a second end. An IC die is thermally coupled to the first end of the thermal conduit. The IC die comprises an interconnect that is coupled to the first end of the thermal conduit. An integrated heat spreader comprises a lid over the IC die and at least one sidewall extending from the edge of the lid to the substrate that is thermally coupled to the second end of the thermal conduit.
    Type: Application
    Filed: December 10, 2018
    Publication date: June 11, 2020
    Applicant: INTEL CORPORATION
    Inventors: Cheng Xu, Zhimin Wan, Lingtao Liu, Yikang Deng, Junnan Zhao, Chandra Mohan Jha, Kyu-oh Lee
  • HIGH PERFORMANCE MICROWAVE DIELECTRIC SYSTEMS AND METHODS
    Publication number: 20180205007
    Abstract: Loss tangents in microwave dielectric materials may be modified (increased and/or reduced), particularly at cryogenic temperatures, via application of external magnetic fields. Exemplary electrical devices, such as resonators, filters, amplifiers, mixers, and photonic detectors, configured with dielectric components having applied magnetic fields may achieve improvements in quality factor and/or modifications in loss tangent exceeding two orders of magnitude.
    Type: Application
    Filed: March 14, 2018
    Publication date: July 19, 2018
    Inventors: Nathan Newman, Lingtao Liu
  • High performance microwave dielectric systems and methods
    Patent number: 9947861
    Abstract: Loss tangents in microwave dielectric materials may be modified (increased and/or reduced), particularly at cryogenic temperatures, via application of external magnetic fields. Exemplary electrical devices, such as resonators, filters, amplifiers, mixers, and photonic detectors, configured with dielectric components having applied magnetic fields may achieve improvements in quality factor and/or modifications in loss tangent exceeding two orders of magnitude.
    Type: Grant
    Filed: August 20, 2014
    Date of Patent: April 17, 2018
    Assignee: Arizona Board of Regents on behalf of Arizona State University
    Inventors: Nathan Newman, Lingtao Liu
  • HIGH PERFORMANCE MICROWAVE DIELECTRIC SYSTEMS AND METHODS
    Publication number: 20160352314
    Abstract: Loss tangents in microwave dielectric materials may be modified (increased and/or reduced), particularly at cryogenic temperatures, via application of external magnetic fields. Exemplary electrical devices, such as resonators, filters, amplifiers, mixers, and photonic detectors, configured with dielectric components having applied magnetic fields may achieve improvements in quality factor and/or modifications in loss tangent exceeding two orders of magnitude.
    Type: Application
    Filed: August 20, 2014
    Publication date: December 1, 2016
    Inventors: Nathan Newman, Lingtao Liu