Abstract: The present disclosure discloses an electro-optic Q-switching double-frequency double-pulse laser lithotripsy system. The system includes a total reflection mirror, an electro-optic Q-switching assembly, a drive circuit, a controller, a pump source, a gain medium, an output mirror, a first focusing mirror, a frequency doubling crystal, a second focusing mirror, a coupling lens and an output optical fiber; the electro-optic Q-switching assembly and the gain medium are located between the total reflection mirror and the output mirror; and the controller controls the pump source to work, and controls a voltage of the electro-optic Q-switching assembly by controlling the drive circuit, so that the system outputs a double-frequency laser beam with a pulse width of 1-1.5 ?s or 200-300 ?s.

Abstract: The present disclosure discloses an electro-optic Q-switching double-frequency double-pulse laser lithotripsy system. The system includes a total reflection mirror, an electro-optic Q-switching assembly, a drive circuit, a controller, a pump source, a gain medium, an output mirror, a first focusing mirror, a frequency doubling crystal, a second focusing mirror, a coupling lens and an output optical fiber; the electro-optic Q-switching assembly and the gain medium are located between the total reflection mirror and the output mirror; and the controller controls the pump source to work, and controls a voltage of the electro-optic Q-switching assembly by controlling the drive circuit, so that the system outputs a double-frequency laser beam with a pulse width of 1-1.5 ?s or 200-300 ?s.

Abstract: A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.

Abstract: A method for cutting sapphire comprising a sapphire body and a coating formed on the sapphire body, the method comprising: focusing a first CO2 laser beam the coating via a CO2 focusing assembly to remove the coating with a predetermined thickness extending along a first path; wherein dust and debris generated during removal of the coating are removed while the coating is removed; focusing an ultrafast laser beam on the sapphire body via an optical path shaping assembly to form a plurality of restructuring channels distributed along a second path and penetrating through the sapphire; wherein the second path coincides with the first path; scanning, by the second CO2 laser beam, the sapphire body via a galvanometer focusing assembly, wherein a path of the second CO2 laser beam scanning the sapphire body via a galvanometer focusing assembly coincides with or deviates from the second path, so that the sapphire cracks along the restructuring channels.