Patents by Inventor Lingyan L. TAN

Lingyan L. TAN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Pre-molded active IC of passive components to miniaturize system in package
    Patent number: 10872832
    Abstract: A system in package and method of making as system in package are disclosed. The system in package has a substrate (102) with a plurality of passive devices (104) mounted thereon. A molding compound (106) envelopes the plurality of passive devices (104) to define a flat surface (116) substantially parallel to a surface of the substrate (102). A plurality of integrated circuit dies (110) is coupled successively to the flat surface (116).
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: December 22, 2020
    Assignee: Intel Corporation
    Inventors: Mao Guo, John G. Meyers, Yong She, Bin Liu, Lingyan L. Tan
  • PRE-MOLDED ACTIVE IC OF PASSIVE COMPONENTS TO MINIATURIZE SYSTEM IN PACKAGE
    Publication number: 20180331004
    Abstract: A system in package and method of making as system in package are disclosed. The system in package has a substrate (102) with a plurality of passive devices (104) mounted thereon. A molding compound (106) envelopes the plurality of passive devices (104) to define a flat surface (116) substantially parallel to a surface of the substrate (102). A plurality of integrated circuit dies (110) is coupled successively to the flat surface (116).
    Type: Application
    Filed: December 16, 2015
    Publication date: November 15, 2018
    Applicant: Intel Corporation
    Inventors: Mao GUO, John G. MEYERS, Yong SHE, Bin LIU, Lingyan L. TAN