Patents by Inventor Ling-Yu Wang

Ling-Yu Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Infrared transceiver package
    Patent number: 5763900
    Abstract: An infrared transceiver packaging hardware including a substrate, a plurality of infrared emitting and receiving elements (IC, photoelectric diode or transistor, contact pins) fastened to the substrate by a wire bonding technique, a shielding case covered on said substrate and connecting it to earth, and an insert mode die filled up with a bonding compound, the shielding case with the substrate being inserted into the bonding compound in the insert mode die, and then sealed with the bonding compound together through a backing process.
    Type: Grant
    Filed: December 5, 1996
    Date of Patent: June 9, 1998
    Assignee: Taiwan Liton Electronic Co. Ltd.
    Inventor: Ling-Yu Wang