Patents by Inventor Lingzi Li

Lingzi Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • High-voltage semiconductor device with finger-shaped insulation structure
    Patent number: 9553188
    Abstract: A high-voltage semiconductor device includes a semiconductor substrate, a gate structure, a drain, an insulation structure, and a plurality of conductive structures. The insulation structure is disposed in the semiconductor substrate and disposed between the gate structure and the drain. The insulation structure includes a plurality of insulation units disposed separately from one another. Each of the conductive structures is embedded in one of the insulation units.
    Type: Grant
    Filed: December 16, 2015
    Date of Patent: January 24, 2017
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Lingzi Li, Zhaobing Li, Hui Lu, Zhang Hu Sun