Abstract: A method and system are disclosed for methods of providing a gaming experience including an in-game viral invite mechanic. In accordance with the present system, inviting others to join in the playing of a game is an objective of the game itself. Thus, a user is encouraged by the game to invite his or her friends, who are in turn encouraged to invite their friends, etc., so that a game may cascade pyramid-fashion to a potentially huge viral fan-out.

Abstract: A method and system are disclosed for methods of providing a gaming experience including an in-game viral invite mechanic. In accordance with the present system, inviting others to join in the playing of a game is an objective of the game itself. Thus, a user is encouraged by the game to invite his or her friends, who are in turn encouraged to invite their friends, etc., so that a game may cascade pyramid-fashion to a potentially huge viral fan-out.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.

Abstract: An interconnection device is provided for temporary connection of a first electronic system to a second electronic system having a support substrate that includes an ordered array of conductive solder pads. A plurality of coil signal contacts are mounted to the conductive solder pads. Each one of the coil signal contacts comprises a central longitudinal axis, a top turn and a bottom turn that are arranged in spaced relation to one another. In this way, the bottom turn of one of the plurality of coil signal contacts is fastened to each of the conductive pads such that the top turns are spaced away from the support substrate.