Abstract: The invention, in some aspects, includes systems, methods and components of molecular recorders that encode the timing of transcriptional activity into the sequence of RNA, which can then enable a sequencing-based readout of the internal dynamics of cells.

Abstract: User interfaces (UIs) for media management and methods for controlling UIs are described. In one example, an electronic device receives an instruction to invoke a media editing functionality of an application. In response to receiving the instruction, the electronic device renders a UI of the application on the electronic device, where the UI includes a first image and an image sliding bar, the image sliding bar comprises a plurality of selected images, and the plurality of selected images respectively correspond to a plurality of images stored in a media library accessible by the application. A first user interaction with the UI is received, and the image sliding bar is hidden in response to the first user interaction. A second user interaction with the UI is received, and the image sliding bar is displayed in response to the second user interaction.

Abstract: Method, apparatus, and user interfaces for editing posts are described. In one example, an electronic device receives user input of at least a part of content of a post on a post editing page of an application on the electronic device. A suggested title of the post is generated based on the at least a part of content of the post. The suggested title of the post is provided on the post editing page. In response to receiving a user confirmation of the suggested title, the suggested title of the post is displayed on the post editing page.

Abstract: Embodiments of the present disclosure provide a method for generating an image collection. The method includes: displaying an image preview page in response to a trigger instruction associated with a first image collection, and at least part of text materials included in the image collection template is displayed in a specified region of the image preview page; displaying at least one image in the specified region in response to acquiring the at least one image, where the at least part of the text materials are overlaid on a corresponding one of the at least one image; and generating a second image collection based on the at least one image and the at least part of the text materials.

Abstract: A data processing method includes: obtaining at least one frame of an original image; performing visual saliency detection on each frame of the original image in the at least one frame of the original image to obtain visual saliency data of each frame of the original image; performing differential processing on different positions of each frame of the original image to obtain at least one frame of a processed target image based on the visual saliency data; and encoding the processed target image.

Abstract: Provided is a FGFR inhibitor, designating a compound represented by formula (I) or a pharmaceutically acceptable salt thereof. Also provided is the application of a drug for treating solid tumors, such as FGFR related diseases.

Abstract: The invention, in some aspects, includes systems, methods and components of molecular recorders that encode the timing of transcriptional activity into the sequence of RNA, which can then enable a sequencing-based readout of the internal dynamics of cells.

Abstract: Disclosed are an FGFR inhibitor and the use thereof in the preparation of a drug for treating FGFR-related diseases. In particular, disclosed are a compound as shown in formula (I) and a pharmaceutically acceptable salt thereof.

Abstract: Disclosed are an FGFR inhibitor and the use thereof in the preparation of a drug for treating FGFR-related diseases. In particular, disclosed are a compound as shown in formula (I) and a pharmaceutically acceptable salt thereof.

Abstract: Provided is a FGFR inhibitor, designating a compound represented by formula (I) or a pharmaceutically acceptable salt thereof. Also provided is the application of a drug for treating solid tumors, such as FGFR related diseases.

Abstract: In one aspect the disclosure is directed to a method for inexpensively producing a Y2O3 nano-powder material, thereby facilitating the increased utilization of the material in different commercial application. In another aspect the disclosure is directed to Y2O3 nano-powder composite materials consisting of Y2O3 and at least one oxide selected from the group consisting of MgO, CaO, BeO2, Al2O3, TiO2, ZrO2, SiO2, HfO2, YbO2, GdO2, Lu2O3 and additional rare earth oxides.

Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract: A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an electroplating process, that generates metal grains that are sufficiently small so as to substantially fill the recessed microstructures. The deposited metal is subsequently subjected to an annealing process at a temperature below about 100 degrees Celsius, and may even take place at ambient room temperature to allow grain growth which provides optimal electrical properties. Various novel apparatus for executing unique annealing processes are also set forth.

Abstract: A method for serially polishing a plurality of semiconductor wafers, wherein a CMP apparatus having a first polishing pad and a second polishing pad is provided. A first slurry composition is disposed between the first polishing pad and a first wafer when the first wafer is in a first state, and a first polishing on the first wafer via the first polishing pad and first slurry composition is commenced at a first commencement time. A second slurry composition is disposed between the second polishing pad and a second wafer when the second wafer is in a second state, and a second polishing on the second wafer via the second polishing pad and second slurry is commenced at a second commencement time, wherein the second commencement time differs from the first commencement time by a first intermediate period. One or more of the first wafer and the second wafer is rinsed with a pre-rinse agent for at least a portion of the first intermediate period.

Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.

Abstract: An improved copper ECD process. After the copper seed layer (116) is formed, a first portion of copper film (118) is plated onto the surface of the seed layer (116). The surface of the first portion of the copper film (118) is then rinsed to equalize the organic adsorption on all sites to prevent preferential copper growth in dense areas. After rinsing, the remaining copper of the copper film (118) is electrochemically deposited.

Abstract: Methods for depositing a metal into a micro-recessed structure in the surface of a microelectronic workpiece are disclosed. The methods are suitable for use in connection with additive free as well as additive containing electroplating solutions. In accordance with one embodiment, the method includes making contact between the surface of the microelectronic workpiece and an electroplating solution in an electroplating cell that includes a cathode formed by the surface of the microelectronic workpiece and an anode disposed in electrical contact with the electroplating solution. Next, an initial film of the metal is deposited into the micro-recessed structure using at least a first electroplating waveform having a first current density. The first current density of the first electroplating waveform is provided to enhance the deposition of the metal at a bottom of the micro-recessed structure.

Abstract: The present invention is directed to a process for producing structures containing metallized features for use in microelectric workpieces. The process treats a barrier layer to promote the adhesion between the barrier layer and the metallized feature. Suitable means for promoting adhesion between barrier layers and the metallized features according to the invention include an acid treatment of the barrier layer, an electrolytic treatment of the barrier layer, or deposition of a bonding layer between the barrier layer and metallized feature. The present invention thus modifies an exterior surface of a barrier layer making it more suitable for electrodeposition of metal on a barrier, thus eliminating the need for a PVD or CVD seed layer deposition process.

Abstract: A process for metallization of a workpiece, such as a semiconductor workpiece. In an embodiment, an alkaline electrolytic copper bath is used to electroplate copper onto a seed layer, electroplate copper directly onto a barrier layer material, or enhance an ultra-thin copper seed layer which has been deposited on the barrier layer using a deposition process such as PVD. The resulting copper layer provides an excellent conformal copper coating that fills trenches, vias, and other microstructures in the workpiece. When used for seed layer enhancement, the resulting copper seed layer provide an excellent conformal copper coating that allows the microstructures to be filled with a copper layer having good uniformity using electrochemical deposition techniques. Further, copper layers that are electroplated in the disclosed manner exhibit low sheet resistance and are readily annealed at low temperatures.