Abstract: A display substrate includes a base and blue light-emitting units disposed on the base. A blue light-emitting unit includes a first electrode, a first light-emitting layer and a second electrode that are sequentially disposed on the base. Of the first electrode and the second electrode, one electrode is configured to reflect light, and another electrode is configured to transmit light. The first light-emitting layer is configured to emit light having a spectrum whose full width at half maximum is less than or equal to 16 nm.

Abstract: One example antenna apparatus includes S groups of antenna bays, S groups of phase-shift feeding networks, and S beamforming networks. An ith group of antenna bays include Ni bays, an ith group of phase-shift feeding networks include Ni phase-shift feeding networks, and the Ni bays are connected to the Ni phase-shift feeding networks. In a first state, an ith beamforming network is configured to form ni beams corresponding to the Ni bays, where Ni first ports corresponding to the beamforming network are connected to the Ni phase-shift feeding networks, ni second ports corresponding to the beamforming network are connected to ni antenna ports, and ni is less than Ni. In a second state, an ith beamforming network is configured to form Ni beams corresponding to the Ni bays, where Ni first ports corresponding to the beamforming network are connected to the Ni phase-shift feeding networks, and Ni second ports corresponding to the beamforming network are connected to Ni antenna ports.

Abstract: A color filter substrate, a manufacturing method thereof and a display panel are provided. The color filter substrate includes a first substrate, at least one spacer on a side of the first substrate, at least one electrode on a side of the at least one spacer facing away the first substrate, and at least two elastic supports on the side of the first substrate. In a plane parallel with an extending plane of the first substrate, a periphery of each spacer comprises at least two of the elastic supports, and in a direction perpendicular to the extending plane of the first substrate, a sum of a height of the spacer and a thickness of the electrode on the spacer is smaller than a height of each of the elastic supports in the periphery of the spacer.

Abstract: The present disclosure provides an organic light-emitting diode display substrate, a method of preparing the same, and a display device. The organic light-emitting diode display substrate includes: a light-emitting layer, a light modulation layer, and a color conversion layer, in which the light-emitting layer is configured to emit first color light, the light modulation layer and the color conversion layer are arranged on different light-exiting paths of the light-emitting layer, the color conversion layer is configured to convert first color light into second color light and third color light, and the light modulation layer is configured to modulate an emergent direction of first color light.

Abstract: An array substrate includes a base substrate, a pixel definition layer, a light-emitting layer, and a plurality of auxiliary electrodes. A pixel definition layer is formed on the base substrate, and includes patterned retaining walls and a plurality of openings defined by the retaining walls. A surface of each of the retaining walls facing away from the base substrate is provided with a first groove. A light-emitting layer is formed on the retaining wall and in the plurality of openings. The light-emitting layer conformally covers respective first grooves of the retaining walls to form respective second grooves. Each of the plurality of auxiliary electrodes is formed in a respective one of the second grooves.

Abstract: A method of modifying a layer in a semiconductor device is provided. The method includes depositing a low quality film on a semiconductor substrate, and exposing a surface of the low quality film to a first process gas comprising helium while the substrate is heated to a first temperature, and exposing a surface of the low quality film to a second process gas comprising oxygen gas while the substrate is heated to a second temperature that is different than the first temperature. The electrical properties of the film are improved by undergoing the aforementioned processes.

Abstract: An organic light-emitting display panel and a fabrication method thereof, and a display apparatus are provided. The organic light-emitting display panel has a display region and a non-display region surrounding the display region in a plan view and includes: a base substrate; a plurality of Organic Light-emitting Diode (OLED) devices, located on the base substrate and in the display region; and a first packaging film, located in both the display region and the non-display region, wherein the plurality of OLED devices are located between the first packaging film and the base substrate, and at least one opening is located in the first packaging film.

Abstract: A packaging method of a display panel, a display panel and a display device are provided. The packaging method includes: providing a first substrate; providing an adhesive with a magnetic material distributed therein; applying the adhesive to a surface of the first substrate to form a first adhesive layer having a first pattern; providing a magnetic field to drive the magnetic material to mobilize the adhesive on the surface of the first substrate, so as to transform the first adhesive layer having the first pattern into a second adhesive layer having a second pattern, wherein, an orthogonal projection of the first adhesive layer having the first pattern on the first substrate is different from an orthogonal projection of the second adhesive layer having the second pattern on the first substrate; and bonding a second substrate onto the adhesive layer having the second pattern.

Abstract: Embodiments of the present disclosure generally relate to methods for forming a high-k gate dielectric in a transistor. The high-k gate dielectric may be formed by introducing a fluorine containing gas into a processing chamber during the deposition of the high-k gate dielectric in the processing chamber. In one embodiment, the high-k gate dielectric is formed by an ALD process in a processing chamber, and a fluorine containing gas is introduced into the processing chamber during one or more stages of the ALD process. Fluorine ions, molecules or radicals from the fluorine containing gas (may be activated by a plasma) can fill the oxygen vacancies in the high-k dielectric.

Abstract: Embodiments described herein generally relate to a method and apparatus for fabricating a chamber component for a plasma process chamber. In one embodiment a chamber component used within a plasma processing chamber is provided that includes a metallic base material comprising a roughened non-planar first surface, wherein the roughened non-planar surface has an Ra surface roughness of between 4 micro-inches and 80 micro-inches, a planar silica coating formed over the roughened non-planar surface, wherein the planar silica coating has a surface that has an Ra surface roughness that is less than the Ra surface roughness of the roughened non-planar surface, a thickness between about 0.2 microns and about 10 microns, less than 1% porosity by volume, and contains less than 2E12 atoms/centimeters2 of aluminum.

Abstract: A laminator includes a turnover abutment and a film laminating device. The turnover abutment includes a first surface and a second surface opposite to each other, and at least one of the first surface and the second surface is a bearing surface on which a plurality of suction structures are provided. The plurality of suction structures are used for sucking a borne object onto the bearing surface. The film laminating device is configured to laminate a film on the borne object on the bearing surface.

Abstract: A method for processing a semiconductor substrate is described herein. The method described herein includes generating fluorine radicals and ions, delivering the fluorine radicals through an ion blocker to a processing region, and removing one or more portions of a gate structure to expose one or more portions of a gate dielectric material disposed thereunder. The gate structure includes at least two ceramic or metal layers, and the gate dielectric material is made of a high-k dielectric material. A substrate having the gate structure and gate dielectric material formed thereon is disposed in the processing region, and the temperature of the substrate is maintained at about 60 degrees Celsius or higher. By etching the gate structure using fluorine radicals at a temperature greater or equal to 60 degrees Celsius, the at least two ceramic or metal layers have a flat cross sectional profile.

Abstract: A dismantling device and a method for dismantling a backlight unit are provided, and the dismantling method includes: placing a liquid crystal module that includes a liquid crystal panel and a backlight unit placed oppositely and connected by a bonding portion onto a supporting table; bringing a line cutting portion that includes two ends and a cutting line therebetween into a gap between the liquid crystal panel and the backlight unit, with at least one of the two ends and the liquid crystal module configured to be movable with respect to each other; and applying a cutting force upon the bonding portion with the line cutting portion along a plane where the bonding portion is located, so as to separate the backlight unit from the liquid crystal panel. This method decreases the force upon the backlight unit to reduce chances of damaging the backlight unit during dismantling the same.

Abstract: Embodiments of the present disclosure provide a polarizer, a display panel, a display apparatus, and a wearable device. The polarizer includes a polarizing layer and a lens layer arranged in stack, wherein the lens layer includes at least one converging lens.

Abstract: A photographic mask is provided in the present disclosure. The photographic mask includes a silicon-on-insulator (SOI) base and a stepped opening formed in the SOI base. The SOI base includes a silicon substrate, a median layer and a silicon layer, the median layer is arranged between the insulator substrate and the insulator layer. The stepped opening includes a first opening portion and a second opening portion, the first opening portion penetrates through the silicon layer and has a first opening area; the second opening portion at least penetrates through the silicon substrate and is aligned with the first opening portion. The second opening portion has a second opening area greater than the first opening area of the first opening portion. The present disclosure further provides a method for making a photographic mask.

Abstract: A film-like structure, a film removing device and a film removing method are provided. The film-like structure includes a thin film, and a to-be-removed film arranged on the thin film and having a magnetic region. The film removing device includes: a working table provided with a support surface onto which the film-like structure is placed; and a film moving mechanism provided with a magnetic member and configured to remove the to-be-removed film from the thin film of the film-like structure through a magnetic force.

Abstract: A pixel definition layer and a manufacturing method thereof, a display substrate, and a display panel are provided. The pixel definition layer includes: a lyophilic material layer on a base substrate, which includes a plurality of lyophilic portions spaced in pairs, which being with an annular structure and used to define a pixel region; and a lyophobic material layer on a side of the lyophilic material layer from the base substrate, which being filled between each two adjacent lyophilic portions of the plurality of lyophilic portions, and a distance from a surface of the lyophobic material layer from the base substrate to the base substrate is larger than a distance from a surface of the lyophilic material layer from the base substrate to the base substrate. The pixel definition layer improves the uniformity of films formed in the pixel region by the solution.

Abstract: An organic light-emitting display panel and a fabrication method thereof, and a display apparatus are provided. The organic light-emitting display panel has a display region and a non-display region surrounding the display region in a plan view and includes: a base substrate; a plurality of Organic Light-emitting Diode (OLED) devices, located on the base substrate and in the display region; and a first packaging film, located in both the display region and the non-display region, wherein the plurality of OLED devices are located between the first packaging film and the base substrate, and at least one opening is located in the first packaging film.

Abstract: A film peeling machine movement assembly is disclosed in the embodiments of the disclosure, including: a film peeling machine provided with a frame having a first portion and a second portion; a first engaging component connected with one of the first portion and the second portion of the frame; and a first moving device provided with a first moving component and a first side engaging component connected with the first moving component for engagement with the first engaging component for moving the film peeling machine along a first path by the first moving component. The film peeling machine movement assembly of the embodiments of the disclosure is applied, so as to grasp and to move the film peeling machine automatically such that the film peeling machine is moved into and out of a replacement chamber and moved into an operational position automatically.

Abstract: A packaging method of a display panel, a display panel and a display device are provided. The packaging method includes: providing a first substrate; providing an adhesive with a magnetic material distributed therein; applying the adhesive to a surface of the first substrate to form a first adhesive layer having a first pattern; providing a magnetic field to drive the magnetic material to mobilize the adhesive on the surface of the first substrate, so as to transform the first adhesive layer having the first pattern into a second adhesive layer having a second pattern, wherein, an orthogonal projection of the first adhesive layer having the first pattern on the first substrate is different from an orthogonal projection of the second adhesive layer having the second pattern on the first substrate; and bonding a second substrate onto the adhesive layer having the second pattern.