Patents by Inventor Linn C. Garrison

Linn C. Garrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for holding a strip of conductive lead frames
    Patent number: 5182851
    Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
    Type: Grant
    Filed: November 22, 1991
    Date of Patent: February 2, 1993
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Michael A. Olla, Barry Morrison, Linn C. Garrison
  • Universal leadframe carrier
    Patent number: 5111935
    Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
    Type: Grant
    Filed: October 31, 1988
    Date of Patent: May 12, 1992
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Michael A. Olla, Barry Morrison, Linn C. Garrison
  • Uniform leadframe carrier
    Patent number: 4815595
    Abstract: A leadframe carrier and insert compatible with a temperature-affectable, expandable and contractable leadframe strip to be bonded with a selected plurality of semiconductor chips, said carrier being automatically separable and removable with regard to said insert during manufacture despite possible clinging which may be induced by the expansion and contraction of said carrier insert.
    Type: Grant
    Filed: March 14, 1988
    Date of Patent: March 28, 1989
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Michael A. Olla, Barry Morrison, Linn C. Garrison
  • Offset bending of curvaceously planar radiating leadframe leads in semiconductor chip packaging
    Patent number: 4743956
    Abstract: A method of forming leadframes for use in manufacturing semiconductor chips starts with fabricating a plurality of leadframes by metal stamping or etching leadframe patterns into a flat ribbon of conductive material. The leadframe patterns include a plurality of outwardly radiating leads, inner radiating leads, and a central perimeter for interconnecting the outwardly and inner radiating leads. The outwardly radiating leads are arranged in groups, each of which are directed along planar perpedicular coordinates. The inner radiating leads have 180 degrees turns in the plane of the leadframe. The inner radiating leads are then successively bent at an acute angle and parallel to the plane of said leadframe so that the inner radiating leads are offset from the plane of the leadframe. The bending is performed in such a manner that each of the leads are formed with a stable spring force for effective bonding to corresponding semiconductor chip pads.
    Type: Grant
    Filed: December 15, 1986
    Date of Patent: May 10, 1988
    Assignee: Thomson Components-Moster Corporation
    Inventors: Michael A. Olla, Linn C. Garrison, Robert H. Bond, Harold Trammell