Patents by Inventor Linn Garrison

Linn Garrison has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Leadframe for flash-free insert molding and method therefor
    Patent number: 4778146
    Abstract: Improved leadframe and method for the insert molding of semiconductor components or the like. A plurality of leads separated by zero-flash tab means for controlling the flash during molding are formed in a single sheet of material. The zero-flash tab means are stamped from the stock sheet and then reinserted into the area between adjacent leads. The zero-flash tab means desirably comprise a ridge section for strength and facilitating removal after the molding operation.
    Type: Grant
    Filed: March 20, 1987
    Date of Patent: October 18, 1988
    Assignee: ASM Fico
    Inventors: Mike Olla, Harold Trammell, Linn Garrison
  • Chip selection in automatic assembly of integrated circuit
    Patent number: 4759675
    Abstract: An apparatus for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and then knocks a die down from the array of dice into a receptacle for transport to further processing stages.
    Type: Grant
    Filed: October 27, 1986
    Date of Patent: July 26, 1988
    Assignee: SGS-Thomson Microelectronics, Inc.
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn Garrison, John D. Pace
  • Integrated-circuit leadframe adapted for a simultaneous bonding operation
    Patent number: 4722060
    Abstract: A leadframe for an integrated circuit includes a set of individual leads temporarily connected in an array; each lead having an exterior portion shaped in a standard form and an interior portion shaped to form a standard array of contacts and to have the same spring constant for deflections perpendicular to the plane of the leadframe.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: January 26, 1988
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Daniel J. Quinn, Robert H. Bond, Wayne A. Mulholland, Steven Swendrowski, Michael A. Olla, Jerry S. Cupples, Barbara R. Mozdzen, Linda S. Wilson, Linn Garrison
  • Chip selection in automatic assembly of integrated circuit
    Patent number: 4627787
    Abstract: A method for removing selected integrated circuit dice from a wafer array of dice sequentially moves a striker above a tape to the underside of which the array is mounted and the knocks a die down from the array of dice into a receptacle for transport to further processing stages.
    Type: Grant
    Filed: March 22, 1984
    Date of Patent: December 9, 1986
    Assignee: Thomson Components-Mostek Corporation
    Inventors: Robert H. Bond, Steven Swendrowski, Michael A. Olla, Barry L. Morrison, Ricky Parkinson, Linn Garrison, John D. Pace