Patents by Inventor Linnell Martinez
Linnell Martinez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20180143332Abstract: The present invention provides a method for using ion filtering to adjust the number of ions delivered to a substrate. The method comprising a process chamber being provided that is operatively connected to a plasma source. The substrate is provided on a substrate support that is provided within the process chamber. An electrical bias source is provided that is operatively connected to an aperture plate that is provided in the process chamber. The substrate on the substrate support is processed using a plasma generated using the plasma source. A variable bias voltage from the electrical bias source is applied to the aperture plate during the plasma processing of the substrate. The plasma processing of the substrate can further comprise exposing the substrate to a plasma time division multiplex process which alternates between deposition and etching on the substrate.Type: ApplicationFiled: November 15, 2017Publication date: May 24, 2018Applicant: Plasma-Therm LLCInventors: Leslie Michael Lea, Linnell Martinez, Michael Morgan, Russell Westerman
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Patent number: 9911654Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: October 6, 2016Date of Patent: March 6, 2018Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 9711406Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: October 6, 2016Date of Patent: July 18, 2017Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 9564366Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: December 18, 2015Date of Patent: February 7, 2017Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20170033008Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: October 6, 2016Publication date: February 2, 2017Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20170025311Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: October 6, 2016Publication date: January 26, 2017Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 9496177Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: May 26, 2015Date of Patent: November 15, 2016Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20160254189Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: ApplicationFiled: May 6, 2016Publication date: September 1, 2016Applicant: Plasma-Therm, LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Patent number: 9368404Abstract: The present invention provides a method for dicing a substrate with back metal, the method comprising the following steps. The substrate is provided with a first surface and a second surface wherein the second surface is opposed to the first surface. A mask layer is provided on the first surface of the substrate and a thin film layer is provided on the second surface of the substrate. The first surface of the substrate is diced through the mask layer to expose the thin film layer on the second surface of the substrate. A fluid from a fluid jet is applied to the thin film layer on the second surface of the substrate after the thin film layer has been exposed by the dicing step.Type: GrantFiled: September 23, 2013Date of Patent: June 14, 2016Assignee: Plasma-Therm LLCInventors: Peter Falvo, Linnell Martinez, David Pays-Volard, Rich Gauldin, Russell Westerman
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Patent number: 9343365Abstract: The present invention provides a method for plasma processing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing at least two cutting regions on the substrate, the cutting regions being positioned between all adjacent device structures on the substrate; generating a plasma using the plasma source; and processing the work piece using the generated plasma.Type: GrantFiled: August 29, 2013Date of Patent: May 17, 2016Assignee: Plasma-Therm LLCInventors: Thierry Lazerand, David Pays-Volard, Linnell Martinez, Chris Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20160111332Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: December 18, 2015Publication date: April 21, 2016Applicant: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20150371878Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: September 1, 2015Publication date: December 24, 2015Applicant: PLASMA-THERM LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: 9202721Abstract: The present invention provides a method for plasma processing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; loading a work piece onto the work piece support, the work piece having a support film, a frame and the substrate; providing a cover ring above the work piece, the cover ring having at least one perforated region, and at least one non-perforated region; generating a plasma using the plasma source; and processing the work piece using the generated plasma.Type: GrantFiled: February 10, 2014Date of Patent: December 1, 2015Assignee: Plasma-Therm LLCInventors: Dwarakanath Geerpuram, David Pays-Volard, Linnell Martinez, Chris Johnson, David Johnson, Russell Westerman
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Patent number: 9202737Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: June 2, 2015Date of Patent: December 1, 2015Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
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Patent number: 9202720Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a cover ring disposed above the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: GrantFiled: February 11, 2013Date of Patent: December 1, 2015Assignee: Plasma-Therm LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20150270121Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: June 3, 2015Publication date: September 24, 2015Applicant: PLASMA-THERM LLCInventors: David Pays-Volard, Linnell Martinez, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20150270154Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising: providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate on a carrier support to form a work piece; providing an intermediate ring interposed between the substrate and the frame; loading the work piece onto the work piece support; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: June 2, 2015Publication date: September 24, 2015Applicant: PLASMA-THERM LLCInventors: Rich Gauldin, Dwarakanath Geerpuram, Ken Mackenzie, Thierry Lazerand, David Pays-Volard, Linnell Martinez, Russell Westerman, Gordon M. Grivna, Jason Doub
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Publication number: 20150255297Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: May 26, 2015Publication date: September 10, 2015Applicant: PLASMA-THERM LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Publication number: 20150255347Abstract: The present invention provides a method for plasma dicing a substrate. The method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing the substrate onto a support film on a frame to form a work piece work piece; loading the work piece onto the work piece support; providing a clamping electrode for electrostatically clamping the work piece to the work piece support; providing a mechanical partition between the plasma source and the work piece; generating a plasma through the plasma source; and etching the work piece through the generated plasma.Type: ApplicationFiled: May 26, 2015Publication date: September 10, 2015Applicant: PLASMA-THERM LLCInventors: Linnell Martinez, David Pays-Volard, Chris Johnson, David Johnson, Russell Westerman, Gordon M. Grivna
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Patent number: RE46339Abstract: The present invention provides a method for plasma dicing a substrate, the method comprising providing a process chamber having a wall; providing a plasma source adjacent to the wall of the process chamber; providing a work piece support within the process chamber; placing a work piece onto the work piece support, said work piece having a support film, a frame and the substrate; loading the work piece onto the work piece support; applying a tensional force to the support film; clamping the work piece to the work piece support; generating a plasma using the plasma source; and etching the work piece using the generated plasma.Type: GrantFiled: September 15, 2015Date of Patent: March 14, 2017Assignee: Plasma-Therm LLCInventors: Rich Gauldin, Chris Johnson, David Johnson, Linnell Martinez, David Pays-Volard, Russell Westerman, Gordon Grivna