Abstract: Provided is a biocompatible composition includes a chitosan-based hydrogel and a dextran solution. Also provided is a method for preparing the biocompatible composition includes reacting the chitosan-based hydrogel with the dextran solution via a cross-linking reaction. Further provided is a method of tissue adhesion includes administering the biocompatible composition to a subject in need thereof.

Abstract: A semiconductor package includes a substrate and at least one integrated circuit (IC) die. Substrate solder resist has substrate solder resist openings exposing substrate bonding pads of the bonding surface of the substrate, and die solder resist has aligned die solder resist openings exposing die bonding pads of the bonding surface of the IC die. A ball grid array (BGA) electrically connects the die bonding pads with substrate bonding pads via the die solder resist openings and the substrate solder resist openings. The die solder resist openings include a subset A of the die solder resist openings in a region A of the bonding surface of the IC die and a subset B of the die solder resist openings in a region B of the bonding surface of the IC die. The die solder resist openings of subset A are larger than those of subset B.

Abstract: An active device substrate includes a substrate, a first thin film transistor located above the substrate and a second thin film transistor located above the substrate. The first thin film transistor includes a first metal oxide layer, a first gate, a first source and a first drain. A first gate dielectric layer and a second gate dielectric layer are located between the first gate and the first metal oxide layer. The second thin film transistor includes a second metal oxide layer, a second gate, a second source and a second drain. The second gate dielectric layer is located between the second gate and the second metal oxide layer, and the second metal oxide layer is located between the first gate dielectric layer and the second gate dielectric layer. The first gate and the second gate belong to a same patterned layer.

Abstract: The present disclosure relates to methods of processing a semiconductor substrate in a processing chamber, such as a chemical vapor deposition chamber. The chemical vapor deposition chamber includes a spindle mechanism that cooperates with one or more carrier ring forks to move the semiconductor substrate from one station to another station. The methods include monitoring one or more spindle operation parameters and carrying out one or more maintenance steps on the spindle mechanism based on the results of monitoring the one or more spindle operation parameters. The monitored spindle operation parameters provide an indication of undesirable vibration of the semiconductor substrates in the processing chamber. The vibration of the semiconductor substrates in the processing chamber is undesirable because it promotes generation of unwanted particles that deposit onto a surface of the semiconductor substrate.

Abstract: An electric control box is provided. The electric control box includes a box body, a circuit board, and a heat sink. The box body has a chamber, and an air inlet and an air outlet that are in communication with the chamber. The chamber has an air duct, and the air inlet and the air outlet are in communication with each other via the air duct. The box body is configured to allow air to be introduced into the air duct from the air inlet and to flow out of the air outlet. The circuit board is disposed in the chamber. The heat sink is disposed at the circuit board and located in the air duct.

Abstract: A rollable display device is provided by the present disclosure. The rollable display device includes a substrate, a display element, a circuit element and a supporting layer. The substrate has a bending portion and a rollable portion. The display element is disposed on the rollable portion. The circuit element is disposed on the bending portion and electrically connected to the display element. The supporting layer is disposed under the substrate, wherein the rollable portion is attached by the supporting layer, and at least a part of the bending portion is not attached by the supporting layer.

Abstract: A novel reactive UV absorber and an anti-blue light eye device comprising the same are provided. The novel reactive UV absorber is a compound represented by the following formula (I): wherein X, R1, R2 and R3 are defined in the specification.

Abstract: A motor mounting structure includes a motor, a first support member, and a second support member. The first support member and the second support member are both disposed at the motor and configured to be fixed. The first support member and the second support member are different from each other.

Abstract: Systems and techniques are described herein for storing depth information. For instance, a method for storing depth information is provided. The method may include obtaining depth information for depth pixels of a depth map; determining, based on the depth information, a respective plurality of depth values for each depth pixel of the depth map; and storing the respective plurality of depth values for each depth pixel of the depth map.

Abstract: An electronic device includes a foldable structure, a first metal layer, a second metal layer and an insulating layer. The first metal layer is disposed on the foldable structure. The second metal layer is disposed on the foldable structure. The first metal layer is disposed between the second metal layer and the foldable structure. The insulating layer is disposed between the foldable structure and the first metal layer. In a side view, the first metal layer comprises a first spacing.

Abstract: An electronic device and a display panel are provided. The display panel includes a substrate, a light-emitting unit, a blocking structure and an encapsulation layer. The substrate has a through hole, a display area, and a non-display area disposed between the through hole and the display area. The light-emitting unit is arranged on the display area. The blocking structure is arranged on the non-display area. The encapsulation layer extends from the display area to the non-display area, and includes an organic layer and a first inorganic layer. A portion of the organic layer is disposed between the blocking structure and the first inorganic layer.

Abstract: The disclosure provides an electronic device including a frame and a transparent display device. The transparent display device is at least partially disposed in the frame, and includes a display panel and a driving element. The display panel includes a display area, a non-display area, and a plurality of pixels. The non-display area is adjacent to the display area. The plurality of pixels are disposed in the display area. A difference between a transmittance of the display area and a transmittance of the non-display area is less than 30% of the transmittance of the display area. The driving element is electrically connected to the plurality of the pixels, wherein when the transparent display device is moved to a state, the display panel is at least partially exposed outside the frame, and the driving element is hidden inside the frame.

Abstract: The disclosure provides a display device. The display device includes a display panel, a substrate and a plurality of vibrators. The substrate overlapped with the display panel. The plurality of vibrators overlapped with the display panel, wherein at least a part of the plurality of vibrators are arranged along a part of an edge of the substrate.

Abstract: An automatic pressure adjustment device for measuring the pressurization demand of battery cells includes a linear force output module, a pressing module, and an elastic module. The pressing module includes a pressing plate and a guide rail. The guide rail is parallel to the linear force direction. The pressing plate is moved along the guide rail by the linear force of the linear force output module. The elastic module includes a first plate, a second plate, at least one elastic member, and at least one pressure sensing unit. The first plate and the pressing plate are sandwiched to form a loading space. The plurality of elastic members are disposed between the first plate and the second plate. The compression direction of the plurality of elastic members is along the linear force direction, and the at least one pressure sensing unit is disposed on one side of the second plate.

Abstract: The present disclosure provides an electronic device including a substrate, a circuit layer, an organic structure, and a sensing structure. The circuit layer is disposed on the substrate, and the circuit layer includes a switch. The organic structure is disposed on the substrate, and in a top view of the electronic device, the organic structure is adjacent to an edge of the substrate. The sensing structure is disposed on the circuit layer, and the sensing structure includes a sensing unit and a wire electrically connected to the sensing unit. The wire crosses over the organic structure and is electrically connected to the switch.

Abstract: An accessory device, and an electronic system and an operation method thereof are provided. The accessory device includes a functional module, a first connection interface, a second connection interface, a switch module, and a microcontroller. The first connection interface is configured to be coupled to an external first electronic device. The second connection interface is configured to be coupled to an external second electronic device. The switch module is disposed between the first connection interface and the second connection interface, and between the first connection interface and the functional module. The microcontroller controls the switch module, so that at least one of the first electronic device, the second electronic device, and the functional module supplies power to at least another one of the first electronic device, the second electronic device, and the functional module.

Abstract: The disclosure relates to an electronic device, including a flexible substrate, a driving structure layer, a display structure layer and a touch layer. The flexible substrate includes an area and a main area adjacent to the area. The driving structure layer is disposed on the flexible substrate. The driving structure layer includes an insulating structure, and the insulating structure includes a plurality of recesses. The display structure layer is disposed on the driving structure layer. The touch layer is disposed on the driving structure layer. A portion of the touch layer is disposed on the area of the flexible substrate. At least a part of the plurality of recesses is disposed on the area of the flexible substrate.

Abstract: A latch calibration system includes a latch, a clock circuit and a calibration circuit. Latch latches logic data from a data node in an internal node. Latch includes two transistors respectively coupled between data node and internal node. Clock circuit generates first and second clock control signals. Calibration circuit is coupled to clock circuit and latch, and includes two bootstrap circuits coupled to clock circuit respectively. First bootstrap circuit generates a third clock control signal according to first clock control signal, which is output to a gate of first transistor. a high level of third clock control signal is greater than that of first clock control signal. Second bootstrap circuit generates a fourth clock control signal according to the second clock control signal, which is output to a gate of second transistor. A low level of fourth clock control signal is less than that of second clock control signal.

Abstract: A solid-state image sensor is provided. The solid-state image sensor includes photoelectric conversion elements and a color filter layer disposed above the photoelectric conversion elements. The color filter layer has a first color filter segment and a second color filter segment adjacent to the first color filter segment. The first color filter segment and the second color filter segment correspond to different colors. The solid-state image sensor also includes a shielding grid structure disposed between the first color filter segment and the second color filter segment. The shielding grid structure is divided into a first shielding segment and a second shielding segment. The solid-state image sensor further includes a meta structure disposed above the color filter layer. In a top view, the second shielding segment is formed as a triangle, a rectangle, or a combination thereof.

Abstract: An electronic device includes an insulating layer and a connective portion at least partially disposed in the insulating layer. The electronic device also includes a processing unit and an electronic element. The processing unit and the electronic element are respectively corresponding to opposite sides of the insulating layer. The processing unit and the electronic element are overlapped with the connective portion.