Patents by Inventor Lin-Ping Li

Lin-Ping Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAT process to avoid wiring defects
    Patent number: 7220677
    Abstract: A method for forming a multi-level semiconductor device to eliminate conductive interconnect protrusions following a WAT test, the method including forming a first metallization layer; carrying out a wafer acceptance testing (WAT) process; and, then carrying out a chemical mechanical polish (CMP) on the metallization layer.
    Type: Grant
    Filed: April 13, 2005
    Date of Patent: May 22, 2007
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Lin-Ping Li, Yung-Cheng Lu, Wen-Chih Chiou, Chih-Hsien Lin
  • WAT process to avoid wiring defects
    Publication number: 20060234403
    Abstract: A method for forming a multi-level semiconductor device to eliminate conductive interconnect protrusions following a WAT test, the method including forming a first metallization layer; carrying out a wafer acceptance testing (WAT) process; and, then carrying out a chemical mechanical polish (CMP) on the metallization layer.
    Type: Application
    Filed: April 13, 2005
    Publication date: October 19, 2006
    Inventors: Lin-Ping Li, Yung-Cheng Lu, Wen-Chih Chiou, Chih-Hsien Lin