Abstract: A heat dissipation optimization method for silicon-based SU-8 thin film packaging, a molybdenum copper sheet is arranged on the back of the embedded chip, and the chip wiring and interconnection is realized on the front side of the silicon substrate through the metal pattern on the SU-8 photoresist, the silicon wafer thinning process on the back side exposes the molybdenum copper sheet from the surface of the silicon substrate and directly contacts the heat sink to achieve heat dissipation optimization; SU-8 photoresist as the packaging medium, and carries out the MEMS process in combination with the silicon substrate, so as to realize abundant three-dimensional structures and fulfill the requirements of high integration and miniaturization of packaging.