Abstract: In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch.

Abstract: A surface coating apparatus for preparing a work piece having a working surface for imprint lithography, wherein the work piece comprises either a mold or a substrate. The apparatus includes a vacuum chamber and a generator to produce chemical reaction radicals for cleaning the working surface. The generator may be located inside said vacuum chamber and connected to an inner surface of said vacuum chamber or external to the vacuum chamber and connected thereto via suitable couplings. A fixture within the vacuum chamber is configured to hold the work piece with the working surface accessible by the chemical reaction radicals, and a means is provided for depositing a molecular layer of surfactant on the working surface inside the vacuum chamber.

Abstract: Apparatus for double-sided imprint lithography of an apertured substrate comprises a pair of correspondingly apertured molds, a support for an assembly of the substrate and molds, and an alignment mechanism with radially movable elements for aligning the apertures of the molds and the substrate. The movable elements can be at least partially disposed in a spindle and can be removed radially outward by a conically tapered drive rod. Opposing surfaces of the substrate can then be imprinted in registration at the same time, preferably by fluid pressure imprint lithography.

Abstract: An imprint system for imprint lithography comprises an alignment subsystem and an imprint subsystem. The mask (mold) and the wafer for imprinting (substrate) are align on the alignment subsystem and contacted to each other to form a mask/wafer set. The mask/wafer set is then transferred onto the imprint subsystem while alignment is maintained. The mask/wafer set is then imprinted on the imprint subsystem. During transfer, the mask/wafer set can be held in alignment by surface. The surface adhesion can be enhanced by local pressing, local heating, or both. Alternatively, the mask/wafer set can be held in alignment by clamping. Advantageously, the imprinting is effected by fluid pressure imprinting.

Abstract: In imprint lithography, the mold is coated with a surface release layer for a non-sticking separation. Bonding strength of the release layer to the mold depends on the cleanness of the surface and the process of release layer deposition. In accordance with the invention, the mold is disposed in an evacuable chamber, cleaned to remove surface organic contamination and coated with the surface release layer in a chamber, all without relocation or undesired time delay. The chamber encloses a support chuck for the mold or substrate, a surface cleaner unit adjacent the support, a heating source adjacent the support, and advantageously, sensors of measuring chamber pressure, vapor partial pressure and moisture concentration. A vapor source connected to the chamber supplies release surfactant vapor. The mold is cleaned, and the cleaning is followed by vapor phase deposition of the surfactant. The mold is advantageously heated. Typical ways of cleaning include exposure to ozone or plasma ion etch.

Abstract: Improved apparatus for imprint lithography involves using direct fluid pressure to press a mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing the mold against the film and disposing the resulting assembly in a pressurized chamber. The result of this fluid pressing is enhanced resolution and high uniformity over an enlarged area.

Abstract: Improved apparatus for imprint lithography involves using direct fluid pressure to press a mold into a substrate-supported film. Advantageously the mold and/or substrate are sufficiently flexible to provide wide area contact under the fluid pressure. Fluid pressing can be accomplished by sealing the mold against the film and disposing the resulting assembly in a pressurized chamber. The result of this fluid pressing is enhanced resolution and high uniformity over an enlarged area.

Abstract: Apparatus for double-sided imprint lithography of an apertured substrate comprises a pair of correspondingly apertured molds, a support for an assembly of the substrate and molds, and an alignment mechanism with radially movable elements for aligning the apertures of the molds and the substrate. The movable elements can be at least partially disposed in a spindle and can be removed radially outward by a conically tapered drive rod. Opposing surfaces of the substrate can then be imprinted in registration at the same time, preferably by fluid pressure imprint lithography.