Patents by Inventor Linshuang Wang

Linshuang Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240194838
    Abstract: A manufacturing method of a splicing display panel and the splicing display panel are provided. Front surfaces of backplates are encapsulated to form first encapsulation layers. Then, at least two backplates are fixed on a transparent substrate to make grooves be formed between lateral surfaces of two adjacent backplates and the transparent substrate. Next, second encapsulation layers are formed in the grooves to obtain an encapsulation semi-finished product. Finally, a third encapsulation layer is formed on a peripheral side of the encapsulation semi-finished product, thereby obtaining the splicing display panel. Technical problems that encapsulation of lateral surfaces of the display panel is difficult and seams of the splicing display panel are obvious can be solved.
    Type: Application
    Filed: June 30, 2022
    Publication date: June 13, 2024
    Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Linshuang Li, Kaijun Wang, Chunge Yuan, Lixuan Chen, Mingzhou Wu
  • Publication number: 20240113265
    Abstract: A display panel and a splicing panel are provided. A driving substrate includes a second surface, and the second surface is a side surface of a driving substrate. A second encapsulation structure includes at least one coating layer and at least one adhesive layer. One of the coating layer and the adhesive layer directly covers the second surface of the driving substrate. In a vertical direction of the second surface of the driving substrate, the coating layer and the adhesive layer are alternately arranged, and both the coating layer and the adhesive layer are organic layers. The coating layer and the adhesive layer using organic materials can, flatten a roughness of the second surface, so as to improve an integrity of the coating layer and the adhesive layer, thereby improving an encapsulation performance.
    Type: Application
    Filed: November 23, 2022
    Publication date: April 4, 2024
    Applicant: TCL China Star Optoelectronics Technology Co., Ltd.
    Inventors: Chunge YUAN, Kaijun WANG, Linshuang LI, Jinyang WANG, Lixuan CHEN
  • Patent number: D967281
    Type: Grant
    Filed: December 20, 2021
    Date of Patent: October 18, 2022
    Inventor: Linshuang Wang
  • Patent number: D987731
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: May 30, 2023
    Inventor: Linshuang Wang