Patents by Inventor Linyu Mu

Linyu Mu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12054576
    Abstract: Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.
    Type: Grant
    Filed: March 5, 2020
    Date of Patent: August 6, 2024
    Assignee: BASF SE
    Inventors: Berend Eling, Stefan Auffarth, Martin Linnenbrink, Julio Albuerne, Linyu Mu
  • Publication number: 20220153906
    Abstract: Described herein is a thermosetting resin composition, obtained from the reaction of at least: a polycarbodiimide (i), where the number of carbodiimide groups per molecule is in the range of from 1 to 10; a mixture of crystalline and amorphous polyols (ii), where the molar ratio of carbodiimide groups in the polycarbodiimide according to (i) to hydroxyl groups in the mixture according to (ii) is in the range of from 1:2 to 2:1 and where at least 25 weight-% of the mixture according to (ii) consists of at least one crystalline polyesterol, based on the overall weight of the mixture being 100 weight-%. Also described herein is a method of using the thermosetting resin composition as an adhesive, as well as processes for preparation of adhesives, an element including an adhesive layer on at least one substrate, and an adhesive film, obtained from one of the processes.
    Type: Application
    Filed: March 5, 2020
    Publication date: May 19, 2022
    Inventors: Berend Eling, Stefan Auffarth, Martin Linnenbrink, Julio Albuerne, Linyu Mu