Abstract: The invention relates to the manufacture of a matrix sensor using a sensitive layer of a ferroelectric P(VDF/TrFE) copolymer, deposited on an integrated circuit. In order to simplify the manufacture and improve the yields, deposited first on the integrated circuit is a first layer of titanium and it is etched in order to form a matrix array of electrodes electrically connected to the integrated circuit; next, a P(VDF/TrFE) copolymer comprising a small proportion of around 1 to 10% of a second polymer that favors the adhesion of the P(VDF/TrFE) copolymer is deposited on the integrated circuit; the polymer is either underneath the P(VDF/TrFE) or blended therewith. The copolymer and its adhesion promoter are etched in a single step, and finally a second conductive layer is deposited and it is etched in order to form a counter electrode for the whole of the matrix array. For use in ultrasonic image sensors.

Abstract: The invention relates to dental radiological image sensors for intraoral use. What is described is a method of fabricating an image sensor, comprising steps for the collective production of a structure combining a semiconductor wafer (12), bearing a series of image detection circuits, and a fiber-optic plate (20) fixed to one face of the wafer, the semiconductor wafer being thinned in a step subsequent to the formation of the image detection circuits on the wafer, and external access contact pads (28) are produced on that face of the wafer which is not fixed to the fiber plate, said contact pads being for controlling the circuits and for receiving image signals coming from the sensor, the fiber-optic plate having a thickness such that it provides most of the mechanical integrity of the structure once the wafer has been thinned, and to do so right to the end of the collective fabrication, the assembled structure consisting of the wafer and the plate being subsequently diced into individual chips.

Abstract: The invention relates to dental radiological image sensors for intraoral use. What is described is a method of fabricating an image sensor, comprising steps for the collective production of a structure combining a semiconductor wafer (12), bearing a series of image detection circuits, and a fiber-optic plate (20) fixed to one face of the wafer, the semiconductor wafer being thinned in a step subsequent to the formation of the image detection circuits on the wafer, and external access contact pads (28) are produced on that face of the wafer which is not fixed to the fiber plate, said contact pads being for controlling the circuits and for receiving image signals coming from the sensor, the fiber-optic plate having a thickness such that it provides most of the mechanical integrity of the structure once the wafer has been thinned, and to do so right to the end of the collective fabrication, the assembled structure consisting of the wafer and the plate being subsequently diced into individual chips.