Patents by Inventor Lionel Powell

Lionel Powell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process and apparatus for mounting semiconductor components to substrates and parts therefor
    Patent number: 6818543
    Abstract: The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.
    Type: Grant
    Filed: July 29, 2002
    Date of Patent: November 16, 2004
    Assignee: Lilogix, Inc.
    Inventors: Zvi Bendat, Henry Chou, Lionel Powell
  • Process and apparatus for mounting semiconductor components to substrates and parts therefor
    Publication number: 20030075939
    Abstract: The present invention provides a process and apparatus for mounting semiconductor components to substrates. More particularly, the apparatus includes a placing mechanism positioned on a support frame for placing the semiconductor components to the substrates. A reflow oven/furnace is integrated into the apparatus, thereby eliminating the need to transport the semiconductor components and substrates to an external furnace. Another feature of the present invention involves providing an improved vacuum substrate chuck array adapted for efficient application of suction to substrates carried thereby. Yet another feature of the invention involves a fluxless reflow process for inhibiting oxidation of eutectic solders provided on substrates.
    Type: Application
    Filed: July 29, 2002
    Publication date: April 24, 2003
    Applicant: LI LOGIX, INC., d/b/a RD AUTOMATION
    Inventors: Zvi Bendat, Henry Chou, Lionel Powell