Abstract: A method and system for defect localization includes: (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, such as charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.

Abstract: Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.

Abstract: A transcoder is described for converting a received first digital signal with a first modulation and encoding scheme to a second digital signal with a second modulation and encoding scheme. The transcoder may include a demodulator that produces a demodulated digital stream of data from the received first digital signal and a modulator in signal communication with the demodulator, where the modulator modulates the digital stream of data with the second modulation and encoding scheme. Additionally, the transcoder may include an upconverter in signal communication with the modulator, where the upconverter produces the second digital signal.

Abstract: Grain size variations within a copper film are quantified by analyzing an SEM image of a portion of the copper film, determining an approximate total length of grain boundaries within the SEM image, and calculating a grain boundary density based on the approximate total length of the grain boundaries and the area of the copper film represented in the SEM image. The calculated grain boundary density allows for correlating plating and anneal process parameters, as well as electrical and reliability performance.

Abstract: A method and system for defect localization includes: (i) receiving a test structure that includes at least one conductor that is at least partially covered by an electro-optically active material; (ii) providing an electrical signal to the conductor, such as charge at least a portion of the conductor; and (iii) imaging the test structure to locate a defect.

Abstract: Methods and systems are described for determining a slice level used for detecting an edge of a horizontal sync pulse of a horizontal line of a video signal, where the horizontal line has a plurality of samples. An exemplary method comprises low-pass filtering the video signal to generate a plurality of filtered samples; determining a first level, wherein a predetermined number of the plurality of filtered samples have levels above the first level; determining a second level, wherein the second level is a minimum level of levels for the plurality of filtered samples; and determining the slice level by adding the first level and the second level to generate a summed level, and dividing the summed level by two to determine the slice level.

Abstract: Methods and systems are described for determining a slice level used for detecting an edge of a horizontal sync pulse of a horizontal line of a video signal, where the horizontal line has a plurality of samples. An exemplary method comprises low-pass filtering the video signal to generate a plurality of filtered samples; determining a first level, wherein a predetermined number of the plurality of filtered samples have levels above the first level; determining a second level, wherein the second level is a minimum level of levels for the plurality of filtered samples; and determining the slice level by adding the first level and the second level to generate a summed level, and dividing the summed level by two to determine the slice level.