Patents by Inventor Lip Seng Tan

Lip Seng Tan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package system with substrate having different bondable heights at lead finger tips
    Patent number: 7986032
    Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
    Type: Grant
    Filed: August 25, 2009
    Date of Patent: July 26, 2011
    Assignee: Stats Chippac Ltd.
    Inventors: Seng Guan Chow, Ming Ying, Ii Kwon Shim, Lip Seng Tan
  • SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS
    Publication number: 20090309237
    Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
    Type: Application
    Filed: August 25, 2009
    Publication date: December 17, 2009
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim, Lip Seng Tan
  • Semiconductor package system with substrate having different bondable heights at lead finger tips
    Patent number: 7598599
    Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
    Type: Grant
    Filed: March 9, 2006
    Date of Patent: October 6, 2009
    Assignee: Stats Chippac Ltd.
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim, Lip Seng Tan
  • SEMICONDUCTOR PACKAGE SYSTEM WITH SUBSTRATE HAVING DIFFERENT BONDABLE HEIGHTS AT LEAD FINGER TIPS
    Publication number: 20070210422
    Abstract: A semiconductor package system is provided. A substrate having a die attach paddle is provided. A first plurality of leads is provided around the die attach paddle having a first plurality of lead tips. A second plurality of leads is provided around the die attach paddle interleaved with the first plurality of leads, at least some of the second plurality of leads having a plurality of depression lead tips. A first die is attached to the die attach paddle. The die is wire bonded to the first plurality of leads and the second plurality of leads. The die is encapsulated.
    Type: Application
    Filed: March 9, 2006
    Publication date: September 13, 2007
    Applicant: STATS CHIPPAC LTD.
    Inventors: Seng Guan Chow, Ming Ying, Il Kwon Shim, Lip Seng Tan