Patents by Inventor Lipeng NIE

Lipeng NIE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220190455
    Abstract: Example embodiments of the present disclosure provide a resonator (100) and a filter (500). The resonator (100) comprises a capacitance metal sheet (110), an inductance metal sheet (120) and a mounting metal sheet (130). The capacitance metal sheet (110) is configured to generate capacitance of the resonator (100) with a top surface (202) of a metal cavity (200) for housing the resonator (100). The inductance metal sheet (120) is configured to generate inductance of the resonator (100), which is connected to the capacitance metal sheet (110) and extends to a bottom surface (204) of the metal cavity (200). The mounting metal sheet (130) is connected to the inductance metal sheet (120) and configured to mount the resonator (100) in the metal cavity (200). The example embodiments of the present disclosure can implement a resonator and a filter with high performance, small size and low cost.
    Type: Application
    Filed: April 3, 2020
    Publication date: June 16, 2022
    Inventors: Shouli JIA, Lipeng NIE, Yunpeng BAI, Hongjun ZHAO
  • Publication number: 20210226310
    Abstract: A cavity filter including a housing, defining a cavity; and a planar resonator arrangement including multiple planar resonators that are arranged in a common plane inside the cavity, wherein the multiple planar resonators include at least: a first planar resonator including a first elongate planar lead terminating at a first planar head, and a second planar resonator including a second elongate planar lead terminating at a second planar head, wherein the first resonator and the second resonator are immediately adjacent and wherein the first elongate planar lead, the first planar head, the second elongate planar lead and the second planar head extend within the common plane.
    Type: Application
    Filed: June 4, 2018
    Publication date: July 22, 2021
    Inventors: Shouli JIA, Lipeng NIE, Hongjun ZHAO