Abstract: A sensor and a preparation method thereof are provided, the sensor includes a sensor substrate, functional cuts, crack-arrest holes, a patterned electrode, wires, an adhesive layer, and release paper. The preparation method includes following steps, preparing the sensor substrate and sticking the adhesive layer on the sensor substrate; then sticking the release paper on the adhesive layer; obtaining the functional cuts by laser cutting or blanking process; pasting a metal mask on a surface of the sensor substrate; depositing a material of the patterned electrode into a gap of the metal mask; removing the metal mask after a solvent of the liquid is volatilized; leading out the wires from patterned electrode pins; obtaining the sensor eventually. The sensor has advantages such as controllable adhesion, small size, light weight, sensitive sensing and simple manufacturing. The sensors are arrayable and suitable for sticking and sensing of large deformation and complex surfaces.

Abstract: The present invention provides a radio frequency channel, including: a first antenna, a low noise amplifier, a power divider, at least two first single-pole, n-throw switches, at least four first filters, and at least two first radio frequency chips. The power divider divides a received radio frequency signal into two first radio frequency sub-signals, and transmits the two first radio frequency sub-signals to the at least four first filters, where the at least four first filters correspond to at least four filtering bands and the at least four first filters may cover frequency bands involved in at least six carrier aggregation CA technologies, the at least four first filters filter the first radio frequency sub-signals, and the at least two first radio frequency chips process the filtered first radio frequency sub-signals.

Abstract: The present invention provide a radio frequency channel, including: a first antenna, a low noise amplifier, a power divider, at least two first single-pole, n-throw switches, at least four first filters, and at least two first radio frequency chips. The power divider divides a received radio frequency signal into two first radio frequency sub-signals, and transmits the two first radio frequency sub-signals to the at least four first filters, where the at least four first filters correspond to at least four filtering bands and the at least four first filters may cover frequency bands involved in at least six carrier aggregation CA technologies, the at least four first filters filter the first radio frequency sub-signals, and the at least two first radio frequency chips process the filtered first radio frequency sub-signals.