Patents by Inventor Liqiang CUI

Liqiang CUI has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • OPTICAL BRIDGE FOR PHOTONIC INTERPOSER TO PHOTONIC INTERPOSER COMMUNICATIONS
    Publication number: 20250216636
    Abstract: Embodiments disclosed herein include photonics packages. In an embodiment, the photonics package comprises a substrate. In an embodiment, a first interposer is over the substrate, and a first die is on the first interposer. In an embodiment, a second interposer is over the substrate, and a second die is on the second interposer. In an embodiment, an optical bridge is between the first interposer and the second interposer.
    Type: Application
    Filed: June 27, 2022
    Publication date: July 3, 2025
    Inventors: Vinod ADIVARAHAN, Liqiang CUI, Kristof DARMAWIKARTA, Gang DUAN, Benjamin DUONG, Shereen ELHALAWATY, Sandeep GAAN, Brandon C. MARIN, Srinivas V. PIETAMBARAM, Marcel SAID
  • NOVEL DESIGN FOR FIBER ARRAY UNIT (FAU) FOR OPTICAL TRANSCEIVER PRODUCTS
    Publication number: 20240069287
    Abstract: A fiber array unit (200) and a photonics system (890), a fiber array unit (200) comprises a substrate (205) with a first el end and a second end. A first mesa (207) is adjacent to the first end and a second mesa (209) is adjacent to the second end. A v-groove (211) is in the first mesa (207) and a slot (213) is in the second mesa (209). The v-groove (211) is aligned with the slot (213).
    Type: Application
    Filed: February 26, 2021
    Publication date: February 29, 2024
    Inventors: Vinod ADIVARAHAN, Liqiang CUI, Aditi MALLIK, Boping XIE, Sunil PRIYADARSHI