Abstract: A window pane includes a transmission control layer including a first glass sheet, a second glass sheet, and a liquid crystal material disposed between the first glass sheet and the second glass sheet. Each of the first glass sheet and the second glass sheet has a thickness of about 1 mm or less. A first panel is bonded to the first glass sheet of the transmission control layer. A second panel is bonded to the second glass sheet of the transmission control layer. The transmission control layer is disposed between the first panel and the second panel. The liquid crystal material is controllable to adjust a transmittance of the window pane.

Abstract: Methods for removing contaminants from a semiconductor device that includes a plurality of aluminum-comprising bond pads on a semiconductor surface of a substrate. A plurality of aluminum-including bond pads are formed on the semiconductor surface of the substrate. A patterned passivation layer is then formed on the semiconductor surface, wherein the patterned passivation layer provides an exposed area for the plurality of bond pads. Wet etching with a basic etch solution is used to etch a surface of the exposed area of the aluminum-including bond pads, wherein the wet etching removes at least 100 Angstroms from the surface of the bond pads to form a cleaned surface.

Abstract: Methods for removing contaminants from a semiconductor device that includes a plurality of aluminum-comprising bond pads on a semiconductor surface of a substrate. A plurality of aluminum-including bond pads are formed on the semiconductor surface of the substrate. A patterned passivation layer is then formed on the semiconductor surface, wherein the patterned passivation layer provides an exposed area for the plurality of bond pads. Wet etching with a basic etch solution is used to etch a surface of the exposed area of the aluminum-including bond pads, wherein the wet etching removes at least 100 Angstroms from the surface of the bond pads to form a cleaned surface.