Abstract: An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.

Abstract: An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.

Abstract: An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.

Abstract: A system that transmits amplitude modulated data in a wavelength-encoded format and then uses a wavelength-sensitive receiver to convert the received optical signal back to the original amplitude modulated data. This system enables transmission of optical signals that are less sensitive to attenuation and attenuation changes. This system is applicable to data in digital, multilevel, or analog formats.

Abstract: A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.

Abstract: An optical transmission system having a single mode laser that generates an optical signal that is carried by a multimode optical fiber to a receiver is disclosed. The single mode laser has an emitting aperture from which the optical signal is routed to the input end of the multimode optical fiber. The receiver receives light from the output end of the optical fiber. The receiver includes an equalizer that corrects the received light for modal dispersion introduced by the multimode optical fiber. Light leaving the emitting aperture of the laser is introduced into the multimode optical fiber in a pattern that excites a subset of the plurality of optical transmission modes thereby reducing the modal dispersion introduced into the light signal and stabilizing the dispersion in time. The improved dispersion enables further correction of the dispersion through the utilization of equalization techniques.

Abstract: A display includes a convertible mirror layer overlying at least a portion of a display screen. The convertible mirror layer converts between a transparent state and a reflective state.

Abstract: A method and apparatus of using an input signal from a single-transverse mode vertical-cavity surface-emitting laser (VCSEL) with a multimode fiber (MMF) link to enable improved stabilization in time variation and improved modal dispersion of the output signal to facilitate the use of adaptive equalization techniques. The improvement results from using a conditioned launch of the input signal from the VCSEL into the MMF link. The increase in performance may be measured by the improved impulse response and an improved bandwidth-distance product of the MMF link.

Abstract: A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.

Abstract: An optical signal emitter for a multi-channel, wavelength division multiplexed (WDM) optical communication system is disclosed. This optical signal emitter does not require an optical multiplexer, or other device, to combine components of an optical signal. Semiconductor die attached to a substrate emit independent components of a multi-channel optical signal from emission apertures that are positioned offset from the center of the die toward an aperture corner of the die. This aperture corner may be shaped so that the apertures can be located closer to each other. The shaping of the die may include a photolithographic process, an etching process, a reactive ion etching process, or a combination thereof.

Abstract: An optical interconnect system includes a plurality of optical circuit boards coupled to an optical backplane. An optical transmitter may be implemented with some or all of the plurality of optical circuit boards. Each optical transmitter is configured to transmit a multi-wavelength light signal. Each of a plurality of optical receivers are separately associated with the plurality of optical circuit boards. In accordance with one embodiment, one or more demultiplexing devices may be used to demultiplex multi-wavelength light signals to discrete wavelengths.

Abstract: A single channel optical interconnect for a fiber optic system includes a penetrator made of optically transmissive material and configured for insertion along the length of a plastic optical fiber for transferring light between the optical fiber and an optoelectronic device. A multiple channel optical interconnect uses a linear array of optoelectronic devices and corresponding optically transmissive penetrators. The penetrators may be pyramidal or conical bodies made of plastic or glass that are positioned above corresponding vertical cavity surface emitting lasers (VCSELs). The penetrators may also be etched directly into the substrates of bottom emitting VCSELs. The penetrators may have specially tailored side wall angles, or coatings, to facilitate coupling into the optical fibers and minimize back reflections into the VCSELs.

Abstract: A folded flex circuit interconnect increases a number of interconnection pads of a grid array interface available to accommodate high count outputs from distinct circuit elements. The circuit interconnect includes a substrate capable of being folded, a conductor layer adjacent to a surface of the substrate, and a pad array having an interconnection pad connected to the conductor layer at a first end of the circuit interconnect. The pad array is part of the grid array interface. An optics module includes the folded flex circuit interconnect and an optical unit. The folded flex circuit interconnect further includes an electrical interface at a second end that is connected to the conductor layer. The folded flex circuit interconnect connects to the optical unit using the electrical interface. The circuit interconnect connects the optical unit to a motherboard using the pad array at the first end.

Abstract: A method and apparatus of using an input signal from a single-transverse mode vertical-cavity surface-emitting laser (VCSEL) with a multimode fiber (MMF) link to enable improved stabilization in time variation and improved modal dispersion of the output signal to facilitate the use of adaptive equalization techniques. The improvement results from using a conditioned launch of the input signal from the VCSEL into the MMF link. The increase in performance may be measured by the improved impulse response and an improved bandwidth-distance product of the MMF link.

Abstract: An optical signal emitter for a multi-channel, wavelength division multiplexed (WDM) optical communication system is disclosed. This optical signal emitter does not require an optical multiplexer, or other device, to combine components of an optical signal. Semiconductor die attached to a substrate emit independent components of a multi-channel optical signal from emission apertures that are positioned offset from the center of the die toward an aperture corner of the die. This aperture corner may be shaped so that the apertures can be located closer to each other. The shaping of the die may include a photolithographic process, an etching process, a reactive ion etching process, or a combination thereof.

Abstract: An optical via within a printed circuit board (PCB) to route optical signals from one level to another through the PCB. The optical signals entering the optical via from an optoelectronic device, or other source, may be routed by an optical waveguide to enter other optical vias to a destination for different purposes. The source of optical signals may be mounted to the PCB or it may be at a distance, with the optical signals being coupled to or away from the optical via by means of optical waveguides.