Patents by Inventor Lisa Anne Windover

Lisa Anne Windover has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Via placement for layer transitions in flexible circuits with high density ball grid arrays
    Patent number: 7223924
    Abstract: A flexible circuit having vias disposed to minimize discontinuity in a ground plane separating opposing transmission lines. The flex circuit comprises a first transmission line coupled to a first surface, a second transmission line coupled to a second opposing surface and a ground plane separating the first transmission line and the second transmission line. The flexible circuit also includes a first type of electrical connection pads disposed on the first surface, and electrically coupled to the first transmission line. The flexible circuit also includes a second type of electrical connection pads disposed on the second surface, and electrically coupled to the second transmission line wherein the second type of electrical connection pads have a higher areal density than the first type of electrical connection pads.
    Type: Grant
    Filed: September 23, 2003
    Date of Patent: May 29, 2007
    Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
    Inventors: Steven Rosenau, Mohammed Ershad Ali, Jonathan Simon, Brian Lemoff, Lisa Anne Windover