Patents by Inventor Lisa Chou

Lisa Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7497724
    Abstract: A cable connector assembly (100) in accordance with the present invention includes a printed circuit board (2) having a number of signal and ground pads (25, 26) alternatively arranged at opposite front and rear ends (21, 22) thereof, a conductive wire organizer (3) including a body portion (30) defining a number of through holes (300) and a number of ground plates (31) integrally extending forwardly from the body portion to electrically connecting with the ground pads of the printed circuit board, and a number of wires (4) protruding through the through holes of the wire organizer. Each wire includes at least one signal conductor (40) soldered with the signal pad of the printed circuit board, an insulator (41) enclosing the at least one signal conductor and a conductor layer (42) enclosing the insulator and electrically connecting with the wire organizer.
    Type: Grant
    Filed: October 4, 2007
    Date of Patent: March 3, 2009
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Jen-Guo Fong, Eric (YunChien) Lin, Pei Tsao, Joseph Tang, An-Jen Yang, Tien-Lu Kao, Yin-Tse Kao, Lisa Chou, Jim Zhao, Wei Yao
  • Patent number: 7435132
    Abstract: A cable connector assembly (100) includes a printed circuit board (2) having a number of signal and ground pads (25, 26) alternatively arranged at opposite front and rear ends thereof, a wire organizer (3) defining a number of through holes (30), a unitary grounding member (6) assembled to the wire organizer and including a number of grounding plates (62) integrally formed therewith to electrically connect with the ground pads of the printed circuit board, and a number of wires (4) protruding through the through holes of the wire organizer. Each wire includes at least one signal conductor (40) soldered with the signal pad of the printed circuit board, an insulator (41) enclosing the at least one signal conductor and a ground conductor (43) electrically connecting with the grounding member to form ground path with the printed circuit board.
    Type: Grant
    Filed: December 12, 2007
    Date of Patent: October 14, 2008
    Assignee: Hon Hai Precision Ind. Co., Ltd.
    Inventors: Jen-Guo Fong, Eric (Yun-chien) Lin, Pei Tsao, Joseph Tang, An-Jen Yang, Tien-Lu Kao, Yin-Tse Kao, Lisa Chou, Jim Zhao, Wei Yao