Patents by Inventor Lisa Jeanine Jimarez

Lisa Jeanine Jimarez has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuit chip carrier assembly
    Patent number: 6503821
    Abstract: An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.
    Type: Grant
    Filed: December 10, 2001
    Date of Patent: January 7, 2003
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, Lisa Jeanine Jimarez, Michael Joseph Klodowski, Jeffrey Alan Zimmerman
  • Integrated circuit chip carrier assembly comprising a stiffener attached to a dielectric substrate
    Patent number: 6329713
    Abstract: An integrated circuit chip carrier assembly is provided by joining a substrate having electrically conductive regions on at least one major surface thereof to a stiffener by a bonding film. The bonding film comprises a dielectric substrate having a thermoset adhesive on both of its major surfaces. The thermoset adhesive prior to the bonding is a B-stage adhesive, is tack-free at normal room temperatures and is solvent free.
    Type: Grant
    Filed: October 21, 1998
    Date of Patent: December 11, 2001
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, Lisa Jeanine Jimarez, Michael Joseph Klodowski, Jeffrey Alan Zimmerman
  • Conductive bonding design and method for aluminum backed circuits
    Patent number: 6178630
    Abstract: The present invention provides a new device and technique for enhancing the electrical properties of the thick metal backer/adhesive bond/ground plane interface. The enhanced electrical properties are obtained by micro-roughening a connection surface of the thick metal backer prior to forming the thick metal backer/adhesive bond/ground plane interface.
    Type: Grant
    Filed: January 12, 1999
    Date of Patent: January 30, 2001
    Assignee: International Business Machines Corporation
    Inventors: Lisa Jeanine Jimarez, David Noel Light, Andrew Michael Seman, David Brian Stone
  • High performance electrical cable and method of manufacture
    Patent number: 5993579
    Abstract: A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.
    Type: Grant
    Filed: June 16, 1997
    Date of Patent: November 30, 1999
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, William Louis Brodsky, Natalie Barbara Feilchenfeld, Lisa Jeanine Jimarez, James Robert Wilcox
  • Selective etching of nickle/iron alloys
    Patent number: 5989443
    Abstract: The present invention provides a novel method of etching nickle/iron alloy which employs a novel etchant. The novel etchant, which etches nickle/iron alloy but not copper, comprises an aqueous solution of ferric ammonium sulfate, and an acid selected from the group consisting of: sulfuric acid; phosphoric acid; and mixtures thereof.
    Type: Grant
    Filed: October 3, 1997
    Date of Patent: November 23, 1999
    Assignee: International Business Machines Corporation
    Inventors: Kathleen Lorraine Covert, Lisa Jeanine Jimarez, Krystyna Waleria Semkow
  • Conductive bonding design for metal backed circuits
    Patent number: 5920037
    Abstract: The present invention provides a new device and technique for enhancing the electrical properties of the thick metal backer/adhesive bond/ground plane interface. The enhanced electrical properties are obtained by micro-roughening a connection surface of the thick metal backer prior to forming the thick metal backer/adhesive bond/ground plane interface.
    Type: Grant
    Filed: May 12, 1997
    Date of Patent: July 6, 1999
    Assignee: International Business Machines Corporation
    Inventors: Lisa Jeanine Jimarez, David Noel Light, Andrew Michael Seman, David Brian Stone
  • Method of solder removal
    Patent number: 5909838
    Abstract: Excess solder is removed from an article such as a circuit substrate or electronic component as is often required after separation of a mounted component from a substrate. A metal foil having a surface with micro-roughness is brought in contact with the solder material and heated to thereby melt the solder, allowing it to flow onto the foil surface. The foil, having the molten solder therein, is then withdrawn.
    Type: Grant
    Filed: November 4, 1997
    Date of Patent: June 8, 1999
    Inventors: Lisa Jeanine Jimarez, Miguel Angel Jimarez
  • High performance electrical cable
    Patent number: 5847324
    Abstract: A composite cable has a reinforcing layer with conductors disposed on opposed planar surfaces. Dielectric film layers electrically separate the conductors on the planar reinforcing layer from respective layers of additional conductors. The flexible cable is manufactured by laminating a layer of dielectric film and a layer of electrically conductive material onto both sides of a double clad core which provides a strain relief reinforcement for the cable.
    Type: Grant
    Filed: April 1, 1996
    Date of Patent: December 8, 1998
    Assignee: International Business Machines Corporation
    Inventors: Donald Seton Farquhar, William Louis Brodsky, Natalie Barbara Feilchenfeld, Lisa Jeanine Jimarez, James Robert Wilcox
  • Selective etching of nickle/iron alloys
    Patent number: 5723062
    Abstract: The present invention provides a novel method of etching nickle/iron alloy which employs a novel etchant. The novel etchant, which etches nickle/iron alloy but not copper, comprises an aqueous solution of ferric ammonium sulfate, and an acid selected from the group consisting of: sulfuric acid; phosphoric acid; and mixtures thereof.
    Type: Grant
    Filed: May 28, 1996
    Date of Patent: March 3, 1998
    Assignee: International Business Machines Corporation
    Inventors: Kathleen Lorraine Covert, Lisa Jeanine Jimarez, Krystyna Waleria Semkow