Abstract: A device package that includes a thin film getter that is deposited on an inside surfaces of a device receiving vacuum sealed cavity or chamber. The thin film getter is deposited using, for example, sputtering, resistive evaporation, e-beam evaporation, or any other suitable deposition technique.

Abstract: A device package that includes a thin film getter that is deposited on an inside surfaces of a device receiving vacuum sealed cavity or chamber. The thin film getter is deposited using, for example, sputtering, resistive evaporation, e-beam evaporation, or any other suitable deposition technique.

Abstract: A high-g shock-producing device for testing a sample specimen is described which includes a beam and a shock column. The beam is of predetermined length and has at least one end substantially rigidly fixed with the specimen mounted thereon at a position remote from the one end. The shock column is positioned to apply a force causing said beam to bend in a direction transverse to the length. The column is configured to have a buckling failure when exposed to a pressure which is sufficient to bend the beam an amount to provide the desired high-g force to the specimen. The buckling failure causes the force to be suddenly removed from the beam so as to release the beam and produce the high-g shock on the specimen.